公开(公告)号：US09844837B2

公开(公告)日：2017-12-19

申请号：US14006538

申请日：2012-03-23

申请人： Masato Shimamura ,  Tsukasa Ohnishi ,  Mitsuhiro Kosai ,  Kazuyori Takagi ,  Tomoko Nonaka ,  Masayuki Suzuki ,  Toru Hayashida ,  Seiko Ishibashi ,  Shunsaku Yoshikawa ,  Yoshie Yamanaka

发明人： Masato Shimamura ,  Tsukasa Ohnishi ,  Mitsuhiro Kosai ,  Kazuyori Takagi ,  Tomoko Nonaka ,  Masayuki Suzuki ,  Toru Hayashida ,  Seiko Ishibashi ,  Shunsaku Yoshikawa ,  Yoshie Yamanaka

IPC分类号： B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  C22F1/16 ,  C22C13/00 ,  C22C13/02

CPC分类号： B23K35/262 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/3618 ,  C22C13/00 ,  C22C13/02 ,  C22F1/16 ,  H01L2924/00013 ,  H01L2924/014 ,  Y10T428/12222 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.

公开(公告)号：US20070243098A1

公开(公告)日：2007-10-18

申请号：US11578827

申请日：2004-07-29

申请人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

发明人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

IPC分类号： C22C13/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00

摘要： [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.

摘要翻译： [问题]移动电子设备在使用或运输过程中经常掉落，电子部件的焊接接头在掉线时有时会因为冲击而脱落。 此外，它们经历热循环，其中内部线圈，电阻器等产生热量和焊接接头在电子设备操作期间温度升高，并在不使用期间冷却。 使用常规的Sn-Ag基底无铅焊料，耐冲击性和耐冲击等微小部分的热循环不足。 本发明提供一种无铅焊料合金，其具有优异的耐冲击性和耐热循环性。 解决问题的手段本发明是一种无铅焊料合金，其包含0.1质量％以下的Ag，0.01质量％以下的Cu，0.01〜0.1质量％的Cu，0.005〜0.1质量％的Zn和余量的Sn， 可以添加Ga，Ge或P，并且可以进一步添加Ni或Co。

公开(公告)号：US07282174B2

公开(公告)日：2007-10-16

申请号：US10533288

申请日：2003-10-31

申请人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

发明人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

IPC分类号： B23K35/26

CPC分类号： B23K35/262 ,  H05K3/3463

摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

摘要翻译： 本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

公开(公告)号：US08896119B2

公开(公告)日：2014-11-25

申请号：US13261584

申请日：2011-08-03

申请人： Yoshitsugu Sakamoto ,  Hiroyuki Yamada ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Shunsaku Yoshikawa ,  Kenzo Tadokoro

发明人： Yoshitsugu Sakamoto ,  Hiroyuki Yamada ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Shunsaku Yoshikawa ,  Kenzo Tadokoro

IPC分类号： H01L23/48 ,  H01L23/00 ,  C22C1/08 ,  B23K35/02 ,  B23K35/30 ,  H01L23/373 ,  C22C9/02 ,  C22C13/00 ,  B23K35/26 ,  H05K3/34

CPC分类号： B23K35/262 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/302 ,  B23K2101/40 ,  C22C1/08 ,  C22C9/02 ,  C22C13/00 ,  H01L23/3735 ,  H01L24/07 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/8309 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/203 ,  H05K3/3463 ,  H05K2201/0116 ,  Y10T428/12479 ,  H01L2924/00014 ,  C22C1/0483 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/0002

摘要： A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

摘要翻译： 提供一种半导体器件，其具有在安装在基板上时不熔化的内部结合。 接合材料用于半导体器件的内部接合。 通过填充具有网状结构的多孔金属体的孔并用Sn或Sn类焊料合金覆盖其表面而获得接合材料。

公开(公告)号：US20130134591A1

公开(公告)日：2013-05-30

申请号：US13261584

申请日：2011-08-03

申请人： Yoshitsugu Sakamoto ,  Hiroyuki Yamada ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Shunsaku Yoshikawa ,  Kenzo Tadokoro

发明人： Yoshitsugu Sakamoto ,  Hiroyuki Yamada ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Shunsaku Yoshikawa ,  Kenzo Tadokoro

IPC分类号： B23K35/26 ,  H01L23/00

CPC分类号： B23K35/262 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/302 ,  B23K2101/40 ,  C22C1/08 ,  C22C9/02 ,  C22C13/00 ,  H01L23/3735 ,  H01L24/07 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/8309 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/203 ,  H05K3/3463 ,  H05K2201/0116 ,  Y10T428/12479 ,  H01L2924/00014 ,  C22C1/0483 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/0002

摘要： A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

摘要翻译： 提供一种半导体器件，其具有在安装在基板上时不熔化的内部结合。 接合材料用于半导体器件的内部接合。 通过填充具有网状结构的多孔金属体的孔并用Sn或Sn类焊料合金覆盖其表面而获得接合材料。

公开(公告)号：US07172726B2

公开(公告)日：2007-02-06

申请号：US10682305

申请日：2003-10-10

申请人： Tsukasa Ohnishi

发明人： Tsukasa Ohnishi

IPC分类号： C22C13/00 ,  B23K35/26

CPC分类号： C23C2/04 ,  B23K35/262 ,  C22C13/00

摘要： A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001–0.5 mass %, and/or Ag in an amount of 0.05–2 mass % as a wettability-improving element.

摘要翻译： 浸渍铜线圈端的熔融状态下使用时，对铜浸出的影响明显较小的无铅焊料含有1.5〜8质量％的Cu，0.01〜2质量％的Co，0.01〜1质量％ 的Ni，余量为Sn，液相线温度为420℃以下。 该焊料可以进一步包含总量为0.001-0.5质量％的选自P，Ge和Ga的至少一种氧化抑制元素，和/或0.05-2质量％的Ag作为 润湿性改善元件。

公开(公告)号：US20060102690A1

公开(公告)日：2006-05-18

申请号：US10533288

申请日：2003-10-31

申请人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

发明人： Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima ,  Toshihiko Taguchi ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi

IPC分类号： B23K35/14

CPC分类号： B23K35/262 ,  H05K3/3463

摘要： The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

摘要翻译： 本发明提供一种Sn-Zn基无铅焊料，即使在焊接了由Cu制成的部分焊接之后的长时间内，也可以防止焊料从焊接部分剥离。 根据本发明的Sn-Zn基无铅焊料包含5-10质量％的Zn，总共0.005-1.0质量％的至少一种选自Au，Pt，Pd，Fe， 和Sb，任选地总共至多15质量％的选自Bi和In的至少一种物质和余量的Sn。 可以使用含有卤化物如胺盐酸盐作为活化剂的松香助熔剂将该Sn-Zn基无铅焊料制成焊膏。

公开(公告)号：US5631267A

公开(公告)日：1997-05-20

申请号：US618860

申请日：1996-03-20

申请人： Gerald J. Gleich ,  Tsukasa Ohnishi ,  Loren W. Hunt

发明人： Gerald J. Gleich ,  Tsukasa Ohnishi ,  Loren W. Hunt

IPC分类号： C07D215/50 ,  A61K9/12 ,  A61K9/72 ,  A61K31/16 ,  A61K31/165 ,  A61K31/167 ,  A61K31/245 ,  A61K31/44 ,  A61K31/445 ,  A61K31/47 ,  A61K45/00 ,  A61P11/00 ,  A61P11/02 ,  A61P11/06 ,  A61P17/00 ,  A61P25/02 ,  A61P25/30 ,  A61P27/02 ,  A61P27/14 ,  A61P43/00 ,  C07D211/60 ,  A61K31/24

CPC分类号： A61K31/44 ,  A61K31/165 ,  A61K31/167 ,  A61K31/245 ,  A61K31/445 ,  Y10S514/826 ,  Y10S514/914

摘要： A therapeutic method is provided to treat eosinophil-associated hypersensitivity diseases, such as bronchial asthma, by locally administering to a mammal in need of such treatment, an effective amount of a topical anesthetic, such as lidocaine, or a pharmaceutically acceptable salt thereof.

摘要翻译： 提供治疗方法以通过局部施用需要这种治疗的哺乳动物，有效量的局部麻醉剂如利多卡因或其药学上可接受的盐来治疗嗜酸性粒细胞相关的超敏反应性疾病，例如支气管哮喘。

公开(公告)号：US09773721B2

公开(公告)日：2017-09-26

申请号：US14314043

申请日：2014-06-25

申请人： Shunsaku Yoshikawa ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Seiko Ishibashi ,  Koji Watanabe ,  Hiroki Ishikawa ,  Yutaka Chiba

发明人： Shunsaku Yoshikawa ,  Yoshie Yamanaka ,  Tsukasa Ohnishi ,  Seiko Ishibashi ,  Koji Watanabe ,  Hiroki Ishikawa ,  Yutaka Chiba

IPC分类号： H01L23/495 ,  B23K35/00 ,  B23K35/02 ,  C22C28/00 ,  H01L23/373 ,  B23K35/26 ,  C23C24/10 ,  H01R43/02

CPC分类号： H01L23/495 ,  B23K35/007 ,  B23K35/0238 ,  B23K35/26 ,  C22C28/00 ,  C23C24/103 ,  H01L23/3736 ,  H01L2924/0002 ,  H01R43/0235 ,  H01L2924/00

摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

公开(公告)号：US08975757B2

公开(公告)日：2015-03-10

申请号：US12736053

申请日：2009-03-03

申请人： Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

发明人： Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B23K35/26 ,  C22C13/00 ,  H01L23/36 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L24/11 ,  B23K35/262 ,  B23K35/268 ,  C22C13/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/05432 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

摘要： Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.

摘要翻译： 用于半导体封装内的倒装芯片焊接的焊料是诸如Pb-5Sn组合物的Sn-Pb焊料。 已经研究的无铅焊料难以容易地与Sn形成金属间化合物，因此它们不适用于半导体封装内的倒装芯片连接结构，这需要应力松弛性能。 该问题通过使用无铅焊料的半导体封装内的倒装芯片连接结构来消除，其特征在于基本上由0.01-0.5质量％的Ni和余量的Sn组成。 可以向该焊料组合物中添加0.3〜0.9质量％的Cu和0.001-0.01质量％的P。