Invention Grant
- Patent Title: Epitaxy layer and method of forming the same
- Patent Title (中): 外延层及其形成方法
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Application No.: US10847099Application Date: 2004-05-17
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Publication No.: US07175709B2Publication Date: 2007-02-13
- Inventor: Pang-Yen Tsai , Liang-Gi Yao , Chun-Chieh Lin , Wen-Chin Lee , Shih-Chang Chen
- Applicant: Pang-Yen Tsai , Liang-Gi Yao , Chun-Chieh Lin , Wen-Chin Lee , Shih-Chang Chen
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: C30B25/04
- IPC: C30B25/04

Abstract:
A method of forming an epitaxial layer of uniform thickness is provided to improve surface flatness. A substrate is first provided and a Si base layer is then formed on the substrate by epitaxy. A Si—Ge layer containing 5 to 10% germanium is formed on the Si base layer by epitaxy to normalize the overall thickness of the Si base layer and the Si—Ge layer containing 5 to 10% germanium.
Public/Granted literature
- US20050252443A1 Epitaxy layer and method of forming the same Public/Granted day:2005-11-17
Information query
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