Abstract:
The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patterned dielectric layer having a plurality of first openings. The method includes forming a conductive liner layer over the patterned dielectric layer, the conductive liner layer partially filling the first openings. The method includes forming a trench mask layer over portions of the conductive liner layer outside the first openings, thereby forming a plurality of second openings, a subset of which are formed over the first openings. The method includes depositing a conductive material in the first openings to form a plurality of vias and in the second openings to form a plurality of metal lines. The method includes removing the trench mask layer.
Abstract:
Disclosed herein is a magnetoresistive structure having a non-planar form. Embodiments of the present MR structure includes those having at least one inflection between a first portion of the MR structure that is somewhat vertical relative to a substrate and a second portion of the MR structure that is somewhat horizontal relative to the substrate. Such a structure can be used for memory device, for example an MRAM memory device, wherein the memory density is increased compared to devices having prior planar MR structures without reducing the surface area of the MR structures.
Abstract:
A web camera includes an image sensor, which takes an external image; a sensor interface, which is connected to the mage sensor to receive and convert the image taken by the image sensor into digital image data; at least one compression module, which is connected to the sensor interface to receive and compress the digital image data into compressed image data; and a USB interface, which is connected to the compression module to output the compressed image data to a host device having a USB interface port, such as a computer and a USB OTG device, for storage, playing back and other applications.
Abstract:
A method of forming an epitaxial layer of uniform thickness is provided to improve surface flatness. A substrate is first provided and a Si base layer is then formed on the substrate by epitaxy. A Si—Ge layer containing 5 to 10% germanium is formed on the Si base layer by epitaxy to normalize the overall thickness of the Si base layer and the Si—Ge layer containing 5 to 10% germanium.
Abstract:
A system for buffering articles in transport is provided. The system comprises a buffer module configured to buffer articles and a computing system. The buffer module includes a first conveyor configured to transport the articles and a transference node configured to transfer the articles between the first conveyor and an external location. The computing system is configured to maintain an inventory list including a present location of each of the articles buffered by the buffer module. The computing system is further configured to control operation of the buffer module to transfer a selected article among the buffered articles to the external location.
Abstract:
A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; a SiGe region in the semiconductor substrate and adjacent the gate stack, wherein the SiGe region has a first atomic percentage of germanium to germanium and silicon; and a silicide region over the SiGe region. The silicide region has a second atomic percentage of germanium to germanium and silicon. The second atomic percentage is substantially lower than the first atomic percentage.
Abstract:
A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
Abstract:
A strained-channel semiconductor structure and method of fabricating the same. The strained-channel semiconductor structure comprises a substrate composed of a first semiconductor material with a first natural lattice constant. A channel region is disposed in the substrate and a gate stack is disposed over the strained channel region. A pair of source/drain regions are oppositely disposed in the substrate adjacent to the channel region, wherein each of the source/drain regions comprises a lattice-mismatched zone comprising a second semiconductor material with a second natural lattice constant rather than the first natural lattice constant, an inner side and an outer side corresponding to the gate stack, and at least one outer sides laterally contacts the first semiconductor material of the substrate.
Abstract:
A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.