Invention Grant
- Patent Title: Semiconductor device and semiconductor wafer
- Patent Title (中): 半导体器件和半导体晶片
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Application No.: US11345288Application Date: 2006-02-02
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Publication No.: US07180199B2Publication Date: 2007-02-20
- Inventor: Satoshi Machida , Takashi Taguchi , Noboru Uchida , Suguru Sasaki
- Applicant: Satoshi Machida , Takashi Taguchi , Noboru Uchida , Suguru Sasaki
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, P.L.L.C.
- Priority: JP2005/059791 20050304
- Main IPC: H01L23/544
- IPC: H01L23/544

Abstract:
A semiconductor device comprises a semiconductor substrate having a first surface and a second surface, and a first multilayer laminated structure film which is formed in the first surface of the semiconductor substrate and has a first layer having a first refractive index, a second layer formed on the first layer and having a second refractive index lower than the first refractive index, and a third layer formed on the second layer and having a third refractive index higher than the second refractive index, and in which the thicknesses of the respective layers are respectively thicknesses calculated by (2N+1)λ/(4n) where the wavelength of light used for detecting the first multilayer laminated structure film is defined as λ, the refractive indices of the respective layers are defined as n, and N is defined as 0 or a natural number.
Public/Granted literature
- US20060197237A1 Semiconductor device and semiconductor wafer Public/Granted day:2006-09-07
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