Invention Grant
- Patent Title: Soldered heat sink anchor and method of use
- Patent Title (中): 焊接散热器锚和使用方法
-
Application No.: US10843408Application Date: 2004-05-11
-
Publication No.: US07183496B2Publication Date: 2007-02-27
- Inventor: George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
- Applicant: George Arrigotti , Tom E. Pearson , Raiyomand F. Aspandiar , Christopher D. Combs
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.
Public/Granted literature
- US20040207076A1 Soldered heat sink anchor and method of use Public/Granted day:2004-10-21
Information query