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    Zero insertion force heat-activated retention pin
    2.
    发明授权
    Zero insertion force heat-activated retention pin 有权
    零插入力热启动保持针

    公开(公告)号：US06764325B2

    公开(公告)日：2004-07-20

    申请号：US10152144

    申请日：2002-05-20

    Applicant: George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

    Inventor： George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

    IPC: H01R1362

    CPC classification number: H05K3/306 ,  H01R4/01 ,  H01R12/7035 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2203/306

    Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

    Abstract translation: 本发明涉及用于最小化载体基底和与其连接的部件之间的开放电连接的装置和方法，其由于暴露于将部件固定到基板而遇到的增加的热分布而由于在基板中的下垂而发生。 零插入力热活化固定销在升温过程中膨​​胀或弯曲，在印刷电路板上产生向上的力。 该向上的力抵抗向下的下垂力，并使载体基板保持与所连接部件的共面关系。

    Interposer to couple a microelectronic device package to a circuit board
    4.
    发明授权
    Interposer to couple a microelectronic device package to a circuit board 有权
    将微电子器件封装耦合到电路板的插入器

    公开(公告)号：US06791035B2

    公开(公告)日：2004-09-14

    申请号：US10080438

    申请日：2002-02-21

    Applicant: Thomas E. Pearson ,  George L. Arrigotti ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    Inventor： Thomas E. Pearson ,  George L. Arrigotti ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    IPC: H05K111

    CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01R12/52 ,  H05K2201/10378 ,  H05K2203/0228 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside with copper. The copper surface coating is etched to form multiple traces. In one embodiment, the substrate is cut through each row of via holes and between each row of via holes to produce multiple individual beam-and-trace interposers. Two or more such interposers may be affixed together to form a beam-and-trace interposer array. Alternatively, the substrate is not cut into strips, and each via hole is filled completely with a conductive material to form an array of solid conductive columns through the substrate.

    Abstract translation: 将微电子器件封装耦合到母板的插入器由PCB基板形成。 通过铜包覆PCB基板钻出多个通孔，然后用铜涂层。 铜表面涂层被蚀刻以形成多个迹线。 在一个实施例中，通过每排通孔和每排通孔之间切割基板以产生多个单独的光束和迹线插入物。 可以将两个或更多个这样的插入件固定在一起以形成光束和迹线插入器阵列。 或者，基板不被切割成条，并且每个通孔都被导电材料完全填充，以通过基板形成固体导电柱的阵列。

    Soldered heat sink anchor and method of use
    7.
    发明授权
    Soldered heat sink anchor and method of use 失效
    焊接散热器锚和使用方法

    公开(公告)号：US07183496B2

    公开(公告)日：2007-02-27

    申请号：US10843408

    申请日：2004-05-11

    Applicant: George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    Inventor： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    IPC: H05K1/16

    CPC classification number: H05K3/308 ,  H01L23/4093 ,  H01L2224/16

    Abstract: An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

    Abstract translation: 提供一种用于将组件固定到印刷电路板的锚定机构和方法。 锚固机构可以包括环，从环延伸的第一腿和从环延伸的第二腿。 第一支腿可以穿过印刷电路板的第一孔，并且包括可插入第一孔中的压缩部分，并且在穿过第一孔之后膨胀。 第一腿部的可压缩部分可以支撑锚定机构和第一孔之间的焊料。 类似地，第二支腿可以安装在印刷电路板的第二孔中，并且包括可插入到第二孔中的可压缩部分，并在通过第二孔之后膨胀。 第二腿的可压缩部分可以支撑锚定机构和第二孔之间的焊料。

    Retainer for circuit board assembly and method for using the same
    8.
    发明授权
    Retainer for circuit board assembly and method for using the same 失效
    电路板组装用保持器及其使用方法

    公开(公告)号：US06875931B2

    公开(公告)日：2005-04-05

    申请号：US10198792

    申请日：2002-07-18

    Applicant: Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson

    Inventor： Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson

    IPC: H05K3/30 ,  H05K3/34 ,  H05R12/04 ,  H05K1/11

    CPC classification number: H05K3/303 ,  H01L2224/81141 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

    Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.

    Abstract translation: 一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。 保持器包括热膨胀构件和保持构件。 由可热膨胀材料形成的热膨胀构件与保持构件联接并围绕其周围设置。 保持构件被构造成与部件联接，并且当组件组装到双面印刷电路板上时，保持构件被形成在双面印刷电路板中的开口接收。 热膨胀构件构造成在组件的组装期间膨胀，与限定开口的内表面接合。 因此，当双面印刷电路板随后被倒置，填充和回流时，该部件被保持和支撑。

    Printed circuit board with embedded thermocouple junctions
    10.
    发明授权
    Printed circuit board with embedded thermocouple junctions 失效
    带嵌入式热电偶接头的印刷电路板

    公开(公告)号：US06472612B2

    公开(公告)日：2002-10-29

    申请号：US09822989

    申请日：2001-03-30

    Applicant: Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson ,  Christopher D. Combs

    Inventor： Arjang Fartash ,  Raiyomand Aspandiar ,  Tom E. Pearson ,  Christopher D. Combs

    IPC: H05K116

    CPC classification number: G01K7/04 ,  H05K1/0201 ,  H05K2201/10151

    Abstract: A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.

    Abstract translation: 第一条带和第二条金属条被嵌入在印刷电路板（PCB）的第一层上以形成结。 连接处具有第一条带尾部和第二条带尾部。 第一条带和第二条带由不同的金属制成。 在第二层上制造第一迹线和第二迹线，以将结点分别延伸到第一迹线焊盘和第二迹线焊盘。 第一和第二迹线被制造在第二层上。 第一和第二迹线分别具有第一端和第二端。 第一端部使用第一通孔连接到第一条带，并且第二端部使用第二通孔连接到第二条带。 将第一导线插入到第一通孔中，将第二导线插入第二通孔以测量PCB的温度。

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