发明授权
- 专利标题: Semiconductor device and method for manufacturing thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11271962申请日: 2005-11-14
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公开(公告)号: US07196384B2公开(公告)日: 2007-03-27
- 发明人: Shimpei Tsujikawa , Toshiyuki Mine , Jiro Yugami , Natsuki Yokoyama , Tsuyoshi Yamauchi
- 申请人: Shimpei Tsujikawa , Toshiyuki Mine , Jiro Yugami , Natsuki Yokoyama , Tsuyoshi Yamauchi
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Renesas Technology Corp.,Hitachi ULSI Systems Co., Ltd.
- 当前专利权人: Renesas Technology Corp.,Hitachi ULSI Systems Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Miles & Stockbridge P.C
- 优先权: JP2002-166630 20020607
- 主分类号: H01L31/00
- IPC分类号: H01L31/00
摘要:
A semiconductor device and a method for manufacturing the same of forming a silicon nitride film selectively without giving damages or contaminations to a surface of the silicon substrate thereby forming different types of gate dielectrics in one identical silicon substrate, are obtained by forming a silicon dioxide on the surface of a silicon substrate, then removing a portion thereof, forming a silicon nitride film to the surface of the substrate from which the silicon dioxide has been removed and, simultaneously, introducing nitrogen to the surface of the silicon dioxide which is left not being removed or, alternatively, depositing a silicon dioxide on the surface of the silicon substrate by chemical vapor deposition, then removing a portion thereof, forming a silicon nitride film on the surface of a substrate from which the silicon dioxide has been removed, and, simultaneously, introducing nitrogen to the surface of the silicon dioxide left not being removed, successively, dissolving and removing nitrogen-introduced silicon oxide film to expose the surface of the substrate and oxidizing the exposed surface of the silicon substrate and the silicon nitride film.
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