Invention Grant
- Patent Title: Semiconductor copper bond pad surface protection
- Patent Title (中): 半导体铜焊垫表面保护
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Application No.: US11084985Application Date: 2005-03-21
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Publication No.: US07199475B2Publication Date: 2007-04-03
- Inventor: Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- Applicant: Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
Public/Granted literature
- US20050181191A1 Semiconductor copper bond pad surface protection Public/Granted day:2005-08-18
Information query
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