发明授权
- 专利标题： Semiconductor copper bond pad surface protection
- 专利标题（中）： 半导体铜焊垫表面保护
-
申请号： US11084985申请日： 2005-03-21
-
公开(公告)号： US07199475B2公开(公告)日： 2007-04-03
- 发明人: Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- 申请人： Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- 申请人地址： US PA Fort Washington
- 专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人地址： US PA Fort Washington
- 代理商 Christopher M. Spletzer, Sr.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
公开/授权文献
- US20050181191A1 Semiconductor copper bond pad surface protection 公开/授权日：2005-08-18
信息查询
IPC分类:
