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公开(公告)号:US07199475B2
公开(公告)日:2007-04-03
申请号:US11084985
申请日:2005-03-21
IPC分类号: H01L23/52
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
摘要翻译: 具有非绝缘部分的铜电路的电子封装件被涂覆层保护,其涂层厚度适于焊接而不进行焊接,并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。
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公开(公告)号:US06885104B2
公开(公告)日:2005-04-26
申请号:US10153451
申请日:2002-05-22
IPC分类号: H01L21/48 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/28 , H01L29/40 , H01L21/94 , B23K20/12 , B23K31/02 , B23K1/00
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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公开(公告)号:US06413576B1
公开(公告)日:2002-07-02
申请号:US09412542
申请日:1999-10-05
IPC分类号: B05D512
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
摘要翻译: 用于保护铜电路的未绝缘部分的表面的方法免受不利于将表面连接到另一金属表面的环境污染物,所述方法包括用具有适于焊接的厚度的陶瓷材料层涂覆表面的步骤 没有助熔剂,并且当表面被接合以获得表面之间的金属对金属接触时,它是足够脆的。 还公开了包括半导体晶片的涂覆电子封装。
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公开(公告)号:US06352743B1
公开(公告)日:2002-03-05
申请号:US09330906
申请日:1999-06-11
IPC分类号: B05D512
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/85 , H01L2224/0382 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48465 , H01L2224/4847 , H01L2224/48647 , H01L2224/48844 , H01L2224/85075 , H01L2224/85375 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , Y10S438/976 , H01L2224/48 , H01L2924/00015
摘要: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.
摘要翻译: 通过涂覆具有适合焊接的厚度的陶瓷材料的层而不会熔化并且在球中足够脆弱的陶瓷材料层,从而防止大气污染物或从铜半导体接合焊盘的接合表面除去大气污染物的方法 或楔形线接合,以在接合表面和与其接合的线之间获得金属对金属的接触。 还公开了涂覆的半导体晶片。
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公开(公告)号:US06534877B2
公开(公告)日:2003-03-18
申请号:US10051482
申请日:2002-01-18
IPC分类号: H01L2348
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/85 , H01L2224/0382 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48465 , H01L2224/4847 , H01L2224/48647 , H01L2224/48844 , H01L2224/85075 , H01L2224/85375 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , Y10S438/976 , H01L2224/48 , H01L2924/00015
摘要: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.
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公开(公告)号:US20050181191A1
公开(公告)日:2005-08-18
申请号:US11084985
申请日:2005-03-21
IPC分类号: H01L21/48 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/28 , B32B3/00 , B32B15/00 , B32B15/04
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
摘要翻译: 具有非绝缘部分的铜电路的电子封装件被涂覆层保护,其涂层厚度适于焊接而不进行焊接,并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。
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公开(公告)号:US20110015612A1
公开(公告)日:2011-01-20
申请号:US12837224
申请日:2010-07-15
IPC分类号: A61M29/02
CPC分类号: A61F2/18 , A61F2210/0004 , A61F2250/0067
摘要: Devices, methods and kits which, when installed or used, urge or maintain patency of sinus ostia, such as the ostium between a nasal passageway and a maxillary sinus, while maintaining some function of cilia extending within or near the ostium. In various examples, the devices comprise a first portion, a second medial portion including a partially open cross-sectional configuration, and a third portion including one or more flexible and outwardly-biased projections. The partially open cross-sectional configuration can maintain a track of uncovered cilia within and near the ostium. In some examples, the devices can include an asymmetric body configuration. In some examples, the first portion includes a U-shaped configuration and the third portion includes at least two flexible and outwardly-biased projections. In some examples, the first, second or third portion includes a medication for delivery into sinus tissues.
摘要翻译: 当安装或使用时,会促使或维持窦口,例如鼻通道和上颌窦之间的口腔通畅,同时保持在口内或附近延伸的纤毛的一些功能的装置,方法和试剂盒。 在各种示例中,装置包括第一部分,包括部分开放的横截面构造的第二内侧部分和包括一个或多个柔性和向外偏置的突起的第三部分。 部分开放的横截面构造可以保持在口内和附近的未覆盖的纤毛的轨迹。 在一些示例中,设备可以包括不对称主体配置。 在一些示例中,第一部分包括U形构造,并且第三部分包括至少两个柔性和向外偏置的突起。 在一些实例中,第一,第二或第三部分包括用于递送至窦组织的药物。
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公开(公告)号:US08435261B2
公开(公告)日:2013-05-07
申请号:US12837256
申请日:2010-07-15
CPC分类号: A61B17/24 , A61B17/3478 , A61F2/82 , A61F2/95 , A61M29/02
摘要: Devices, methods and kits which, when installed or used, access, aspire, dilate, insufflate, drain or deliver fluid medicaments to, or place a patency device within a sinus area, such as a maxillary sinus or a maxillary sinus ostium. The device can include a hollow catheter and probe, and can be configured to permit gradual and incremental probe extension. The device can be constructed to enhance the precision and maneuverability within the nasal and sinus passageways, while also accommodating the natural anatomical geometry of a targeted paranasal treatment site. For example, the present treatment and placement device can accomplish access to the maxillary sinus ostium by utilizing an uncinate process to guide a probe tip into the ostium in a retrograde manner. The probe can be slidably, bi-directionally or co-axially positioned within the catheter. A distal portion of the probe can be biased away from a longitudinal axis of the catheter.
摘要翻译: 在安装或使用时,可以进入,吸引,扩张,吹入,排出或输送液体药物或将通畅装置放置在鼻窦区域(如上颌窦或上颌窦口)内的装置,方法和试剂盒。 该装置可以包括中空导管和探针,并且可以被配置为允许逐渐和增量的探针延伸。 该装置可以构造成增强鼻窦通道内的精确度和机动性,同时还适应目标鼻旁处理部位的天然解剖几何形状。 例如,本治疗和放置装置可以通过利用钩形过程来以逆行方式将探针尖端引导到口中来完成对上颌窦口的通路。 探针可以可滑动地,双向地或同轴地定位在导管内。 探针的远端部分可被偏压远离导管的纵向轴线。
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公开(公告)号:US08933416B2
公开(公告)日:2015-01-13
申请号:US13319875
申请日:2010-05-11
CPC分类号: A61L2/10 , A61L2/0047 , A61L2202/11 , A61L2202/14 , A61L2202/24 , A61M25/0111 , A61M25/0662 , A61M39/0247 , A61M2039/0273 , A61M2039/0279 , A61M2039/0285 , A61N5/0601 , Y10T29/49002 , Y10T29/49826
摘要: A device includes a sheath having a lumen defined by a wall. The wall has an outer surface that is configured to emit ultraviolet light in a direction substantially normal to the wall. The lumen has a distal end configured for percutaneous placement. The lumen has a proximal end configured to receive a catheter.
摘要翻译: 一种装置包括具有由壁限定的内腔的护套。 该壁具有外表面,该外表面构造成在基本上垂直于壁的方向上发射紫外光。 管腔具有被配置用于经皮放置的远端。 内腔具有构造成接收导管的近端。
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公开(公告)号:US20120161032A1
公开(公告)日:2012-06-28
申请号:US13319875
申请日:2010-05-11
CPC分类号: A61L2/10 , A61L2/0047 , A61L2202/11 , A61L2202/14 , A61L2202/24 , A61M25/0111 , A61M25/0662 , A61M39/0247 , A61M2039/0273 , A61M2039/0279 , A61M2039/0285 , A61N5/0601 , Y10T29/49002 , Y10T29/49826
摘要: A device includes a sheath having a lumen defined by a wall. The wall has an outer surface that is configured to emit ultraviolet light in a direction substantially normal to the wall. The lumen has a distal end configured for percutaneous placement. The lumen has a proximal end configured to receive a catheter.
摘要翻译: 一种装置包括具有由壁限定的内腔的护套。 该壁具有外表面,该外表面构造成在基本上垂直于壁的方向上发射紫外光。 管腔具有被配置用于经皮放置的远端。 内腔具有构造成接收导管的近端。
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