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公开(公告)号:US20050181191A1
公开(公告)日:2005-08-18
申请号:US11084985
申请日:2005-03-21
IPC分类号: H01L21/48 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/28 , B32B3/00 , B32B15/00 , B32B15/04
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
摘要翻译: 具有非绝缘部分的铜电路的电子封装件被涂覆层保护,其涂层厚度适于焊接而不进行焊接,并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。
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公开(公告)号:US06885104B2
公开(公告)日:2005-04-26
申请号:US10153451
申请日:2002-05-22
IPC分类号: H01L21/48 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/28 , H01L29/40 , H01L21/94 , B23K20/12 , B23K31/02 , B23K1/00
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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公开(公告)号:US06413576B1
公开(公告)日:2002-07-02
申请号:US09412542
申请日:1999-10-05
IPC分类号: B05D512
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
摘要翻译: 用于保护铜电路的未绝缘部分的表面的方法免受不利于将表面连接到另一金属表面的环境污染物,所述方法包括用具有适于焊接的厚度的陶瓷材料层涂覆表面的步骤 没有助熔剂,并且当表面被接合以获得表面之间的金属对金属接触时,它是足够脆的。 还公开了包括半导体晶片的涂覆电子封装。
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公开(公告)号:US07199475B2
公开(公告)日:2007-04-03
申请号:US11084985
申请日:2005-03-21
IPC分类号: H01L23/52
CPC分类号: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
摘要翻译: 具有非绝缘部分的铜电路的电子封装件被涂覆层保护,其涂层厚度适于焊接而不进行焊接,并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。
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