公开(公告)号：US20120006679A1

公开(公告)日：2012-01-12

申请号：US12833711

申请日：2010-07-09

Applicant: Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

Inventor： Timothy W. Ellis ,  Matthew Burr ,  Elton Jones

IPC: C25B11/00 ,  B23K31/02 ,  B23K20/12

CPC classification number: C25C7/02 ,  B23K20/1265 ,  B23K20/127 ,  B23K20/129

Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.

Abstract translation: 使用摩擦搅拌焊接（FSW）接头形成电化学阳极。 母线和阳极片或铅封装和阳极片之间可以形成FSW接头。 FSW接头还可以包括圆角和对接接头。 也可以使用FSW接头来密封电化学阳极的端部以防止腐蚀。

公开(公告)号：US06885104B2

公开(公告)日：2005-04-26

申请号：US10153451

申请日：2002-05-22

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H01L29/40 ,  H01L21/94 ,  B23K20/12 ,  B23K31/02 ,  B23K1/00

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

公开(公告)号：US06413576B1

公开(公告)日：2002-07-02

申请号：US09412542

申请日：1999-10-05

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC: B05D512

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.

Abstract translation: 用于保护铜电路的未绝缘部分的表面的方法免受不利于将表面连接到另一金属表面的环境污染物，所述方法包括用具有适于焊接的厚度的陶瓷材料层涂覆表面的步骤 没有助熔剂，并且当表面被接合以获得表面之间的金属对金属接触时，它是足够脆的。 还公开了包括半导体晶片的涂覆电子封装。

公开(公告)号：US08714361B2

公开(公告)日：2014-05-06

申请号：US12776822

申请日：2010-05-10

Applicant: Timothy W. Ellis

Inventor： Timothy W. Ellis

IPC: B02C23/10 ,  B02C23/14 ,  B03B9/06 ,  B03D1/02 ,  B03D1/08

CPC classification number: H01M10/54 ,  B03D1/02 ,  H01M6/52 ,  Y02W30/84

Abstract: Materials in battery and electrochemical cells are separated in a form suitable for recycling by employing froth flotation techniques. Bulk materials, such as casings, are removed from converted battery scrap and the resultant pulp is subjected to froth flotation. Froth flotation agents, including frothers, collectors and/or depressants, are used to manipulate the hydrophilic and hydrophobic nature of the materials in the scrap. Hydrophobic materials are entrained in the air bubbles of the froth and float out of the froth flotation vessel while those that are hydrophilic remain in the vessel, thereby separating battery grid materials without resort to pyrometallurgical, energy intensive or other environmentally undesirable processes.

Abstract translation: 电池和电化学电池中的材料通过使用泡沫浮选技术以适于再循环的形式分离。 散装材料，例如外壳，从转换后的电池废料中取出，所得纸浆进行泡沫浮选。 泡沫浮选剂，包括起泡剂，收集剂和/或抑制剂，用于操纵废料中材料的亲水性和疏水性。 疏水材料被夹带在泡沫的气泡中并漂浮在泡沫浮选槽中，而亲水的那些留在容器中，从而分离电池栅格材料，而不需要采用火法冶金，能源密集型或其他不利环境的方法。

公开(公告)号：US06534877B2

公开(公告)日：2003-03-18

申请号：US10051482

申请日：2002-01-18

Applicant: Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

Inventor： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

IPC: H01L2348

CPC classification number: H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/85 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/85075 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  Y10S438/976 ,  H01L2224/48 ,  H01L2924/00015

Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

公开(公告)号：US20120222550A1

公开(公告)日：2012-09-06

申请号：US13037921

申请日：2011-03-01

Applicant: Timothy W. Ellis ,  Henry V. Krigmont

Inventor： Timothy W. Ellis ,  Henry V. Krigmont

IPC: B03C3/16

CPC classification number: B03C3/16 ,  B01D53/1456 ,  B01D53/64 ,  B01D2252/103 ,  B03C3/14 ,  B03C3/145 ,  B03C3/49 ,  B03C2201/08 ,  B03C2201/10

Abstract: An emissions reduction stack comprises a conditioning section, collector section utilizing a Wet Electrostatic Precipitator (WESP), and output section. A chemically active aqueous stream is introduced into an incoming process stream in order to saturate the stream and produce a fog stream wherein water is condensed on the surface of particulates. The process of condensation increases the efficiency of the particulate filtration process conducted by the WESP.

Abstract translation: 排放减少堆叠包括调节部分，利用湿式静电除尘器（WESP）的收集器部分和输出部分。 将化学活性的含水物流引入进入的工艺流中，以便使流饱和并产生雾流，其中水在颗粒表面上被冷凝。 冷凝过程增加了WESP进行的颗粒过滤过程的效率。

公开(公告)号：US20120118758A1

公开(公告)日：2012-05-17

申请号：US12948560

申请日：2010-11-17

Applicant: TIMOTHY W. ELLIS ,  Matthew Burr

Inventor： TIMOTHY W. ELLIS ,  Matthew Burr

IPC: C25C7/02 ,  B24B55/12 ,  C25C1/00 ,  B24B7/12

CPC classification number: B24B21/06 ,  B24B21/10 ,  B24B21/12

Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.

Abstract translation: 使用砂光机构形成电极以调节用于电化学目的的电极的表面。 打磨期间发出的有害颗粒是用喷射液体捕获的，可以再循环使用。 磨砂表面提供增加的电极寿命和氧化铅粘附。

公开(公告)号：US6074453A

公开(公告)日：2000-06-13

申请号：US959167

申请日：1997-10-28

Applicant: Iver E. Anderson ,  Timothy W. Ellis ,  Vitalij K. Pecharsky ,  Jason Ting ,  Robert Terpstra ,  Robert C. Bowman ,  Charles K. Witham ,  Brent T. Fultz ,  Ratnakumar V. Bugga

Inventor： Iver E. Anderson ,  Timothy W. Ellis ,  Vitalij K. Pecharsky ,  Jason Ting ,  Robert Terpstra ,  Robert C. Bowman ,  Charles K. Witham ,  Brent T. Fultz ,  Ratnakumar V. Bugga

IPC: B22F9/08 ,  C01B3/00 ,  C22C1/04 ,  H01M4/38 ,  H01M4/62 ,  H01M8/06 ,  H01M10/34 ,  B22F3/00 ,  B22F1/00

CPC classification number: B22F9/082 ,  C01B3/0047 ,  C01B3/0057 ,  C01B3/0084 ,  C22C1/0441 ,  H01M4/383 ,  H01M4/626 ,  H01M8/065 ,  B22F2998/00 ,  B22F2998/10 ,  H01M10/345 ,  Y02E60/327 ,  Y02P70/56 ,  Y10S420/90

Abstract: A method of making hydrogen storage powder resistant to fracture in service involves forming a melt having the appropriate composition for the hydrogen storage material, such, for example, LaNi.sub.5 and other AB.sub.5 type materials and AB.sub.5+x materials, where x is from about -2.5 to about +2.5, including x=0, and the melt is gas atomized under conditions of melt temperature and atomizing gas pressure to form generally spherical powder particles. The hydrogen storage powder exhibits improved chemcial homogeneity as a result of rapid solidfication from the melt and small particle size that is more resistant to microcracking during hydrogen absorption/desorption cycling. A hydrogen storage component, such as an electrode for a battery or electrochemical fuel cell, made from the gas atomized hydrogen storage material is resistant to hydrogen degradation upon hydrogen absorption/desorption that occurs for example, during charging/discharging of a battery. Such hydrogen storage components can be made by consolidating and optionally sintering the gas atomized hydrogen storage powder or alternately by shaping the gas atomized powder and a suitable binder to a desired configuration in a mold or die.

Abstract translation: 制备耐贮存粉末的方法是使用具有合适的储氢材料成分的熔体，例如LaNi5和其他AB5型材料和AB5 + x材料，其中x为约-2.5 至约+2.5，包括x = 0，并且熔体在熔体温度和雾化气体压力的条件下被气体雾化，以形成通常为球形的粉末颗粒。 储氢粉末由于熔体的快速固化和在氢吸收/解吸循环期间更耐微裂纹的小粒径而显示出改进的化学均匀性。 由气体雾化的储氢材料制成的蓄电池组件，例如用于电池或电化学燃料电池的电极，例如在电池充电/放电期间，例如在氢吸收/解吸附时，耐氢降解。 这样的储氢组分可以通过固化和任选地烧结气体雾化的氢存储粉末或者通过将气体雾化粉末和合适的粘合剂成形为模具或模具中所需的构型来制备。

公开(公告)号：US5433978A

公开(公告)日：1995-07-18

申请号：US127264

申请日：1993-09-27

Applicant: Jeffrey E. Shield ,  Alan I. Goldman ,  Iver E. Anderson ,  Timothy W. Ellis ,  R. William McCallum ,  Daniel J. Sordelet

Inventor： Jeffrey E. Shield ,  Alan I. Goldman ,  Iver E. Anderson ,  Timothy W. Ellis ,  R. William McCallum ,  Daniel J. Sordelet

IPC: B22F1/00 ,  B22F9/08 ,  C22C1/04 ,  C22C21/12

CPC classification number: B22F9/082 ,  B22F1/0007 ,  C22C1/0416 ,  C22C21/12 ,  B22F2998/00

Abstract: A method of making quasicrystalline alloy particulates wherein an alloy is superheated and the melt is atomized to form generally spherical alloy particulates free of mechanical fracture and exhibiting a predominantly quasicrystalline in the atomized condition structure. The particulates can be plasma sprayed to form a coating or consolidated to form an article of manufacture.

Abstract translation: 一种制备准晶体合金微粒的方法，其中合金过热并且熔体被雾化以形成通常不具有机械断裂的球形合金微粒并且在雾化状态结构中显示出主要的准晶体。 颗粒可以被等离子体喷涂以形成涂层或固结以形成制品。

公开(公告)号：US5368657A

公开(公告)日：1994-11-29

申请号：US48138

申请日：1993-04-13

Applicant: Iver E. Anderson ,  Barbara K. Lograsso ,  Timothy W. Ellis

Inventor： Iver E. Anderson ,  Barbara K. Lograsso ,  Timothy W. Ellis

IPC: B22F9/08 ,  C22C1/10 ,  B22F9/00 ,  B22D23/00

CPC classification number: C22C1/1042

Abstract: A metallic melt is atomized using a high pressure atomizing gas wherein the temperature of the melt and the composition of the atomizing gas are selected such that the gas and melt react in the atomization spray zone to form a refractory or intermetallic compound in the as-atomized powder particles.A metallic melt is also atomized using a high pressure atomizing gas mixture gas wherein the temperature of the melt and the ratio of a reactive gas to a carrier gas are selected to form powder particles comprising a supersaturated solid solution of the atomic species of the reactive gas in the particles. The powder particles are then heat treated to precipitate dispersoids in-situ therein to form a dispersion strengthened material.

Abstract translation: 使用高压雾化气体使金属熔体雾化，其中熔体的温度和雾化气体的组成被选择为使得气体和熔体在雾化喷射区中反应以在雾化的气体中形成耐火材料或金属间化合物 粉末颗粒。 金属熔体还使用高压雾化气体混合气体雾化，其中熔体的温度和反应气体与载气的比率被选择以形成包含反应气体的原子种类的过饱和固溶体的粉末颗粒 在颗粒中。 然后将粉末颗粒热处理以原位沉淀分散体，形成分散强化材料。