Methods and apparatus are provided for detecting leaks in a MEMS sensor package, and in particular, a MEMS sensor package that includes an oscillating structure or element that has a Quality (Q) value. The method and apparatus may include measuring the Q value of the MEMS sensor at a first time, applying a pressure to the outside of the MEMS sensor package, and measuring the Q value of the MEMS sensor at a second time after pressure has been applied for a period of time. A change in the measured Q values between the first time and the second time may be determined, which may then be correlated to a leak rate for the particular MEMS sensor package. In some cases, a leak rate of 2×10−13 He atm.cc/s or less may be detected.