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    Manifold for processing a stacked array of laser block assemblies
    1.
    发明授权
    Manifold for processing a stacked array of laser block assemblies 失效
    用于处理激光组件堆叠阵列的歧管

    公开(公告)号：US06819430B2

    公开(公告)日：2004-11-16

    申请号：US09756246

    申请日：2001-01-08

    申请人： Mark J. Jarrett ,  Edgar R. Mallison

    发明人： Mark J. Jarrett ,  Edgar R. Mallison

    IPC分类号： G01C1964

    CPC分类号： G01C25/005 ,  G01C19/661

    摘要： A manifold for providing the simultaneous processing of a plurality of laser block assemblies. In one embodiment, the manifold includes a hollow passage formed along the length of the manifold, and a plurality of passages extending between the hollow chamber and the exterior of the manifold. A laser block assembly is mounted to each of the plurality of passages of manifold. The assemblies can be arranged in a flat or parallel spaced arrangement relative to each other, and are mounted to the manifold with a fitting that is adapted to be easily severed after processing of the assemblies is completed. The manifold is mounted to a station of a processing tool, and a plurality of processing applications are performed on the plurality of laser block assemblies in a simultaneous fashion.

    摘要翻译： 一种用于提供多个激光组件的同时处理的歧管。 在一个实施例中，歧管包括沿着歧管的长度形成的中空通道，以及在中空室和歧管的外部之间延伸的多个通道。 激光器组件安装到歧管的多个通道中的每一个上。 组件可以相对于彼此以平坦或平行的间隔布置地布置，并且被安装到具有适于在组件的处理完成之后易于切断的配件的歧管。 歧管安装到处理工具的工位，并且以同时方式在多个激光块组件上执行多个处理应用。

    MEMS sensor package leak test
    2.
    发明授权
    MEMS sensor package leak test 失效
    MEMS传感器封装泄漏测试

    公开(公告)号：US07210337B1

    公开(公告)日：2007-05-01

    申请号：US11163388

    申请日：2005-10-17

    申请人： Mark J. Jarrett

    发明人： Mark J. Jarrett

    IPC分类号： G01M3/34

    CPC分类号： G01M3/3281

    摘要： Methods and apparatus are provided for detecting leaks in a MEMS sensor package, and in particular, a MEMS sensor package that includes an oscillating structure or element that has a Quality (Q) value. The method and apparatus may include measuring the Q value of the MEMS sensor at a first time, applying a pressure to the outside of the MEMS sensor package, and measuring the Q value of the MEMS sensor at a second time after pressure has been applied for a period of time. A change in the measured Q values between the first time and the second time may be determined, which may then be correlated to a leak rate for the particular MEMS sensor package. In some cases, a leak rate of 2×10−13 He atm.cc/s or less may be detected.

    摘要翻译： 提供了用于检测MEMS传感器封装中的泄漏的方法和装置，特别是包括具有质量（Q）值的振荡结构或元件的MEMS传感器封装。 该方法和装置可以包括在第一时间测量MEMS传感器的Q值，向MEMS传感器封装的外部施加压力，并且在施加压力之后的第二时间测量MEMS传感器的Q值 一段时间。 可以确定第一时间和第二时间之间的测量Q值的变化，其然后可以与特定MEMS传感器封装的泄漏率相关。 在某些情况下，可以检测到2×10 -6 -Th at at.cc/s以下的泄漏率。