发明授权
- 专利标题： Space-efficient package for laterally conducting device
- 专利标题（中）： 横向传导装置的节省空间的包装
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申请号： US10735585申请日： 2003-12-12
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公开(公告)号： US07215012B2公开(公告)日： 2007-05-08
- 发明人: James Harnden , Allen K. Lam , Richard K. Williams , Anthony Chia , Chu Weibing
- 申请人： James Harnden , Allen K. Lam , Richard K. Williams , Anthony Chia , Chu Weibing
- 申请人地址： US CA Santa Clara
- 专利权人： GEM services, Inc.
- 当前专利权人： GEM services, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Townsend and Townsend and Crew LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48 ; H01L23/52
摘要：
Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad portion may occupy area at the end or side of the package formerly occupied by non-integral leads. By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die having a larger area, thereby enhancing space efficiency of the package.
公开/授权文献
- US20040173881A1 Space-efficient package for laterally conducting device 公开/授权日：2004-09-09
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