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公开(公告)号:US20120181676A1
公开(公告)日:2012-07-19
申请号:US13348283
申请日:2012-01-11
申请人: Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
发明人: Anthony C. Tsui , Hongbo Yang , Ming Zhou , Weibing Chu , Anthony Chia
IPC分类号: H01L23/495 , H01L21/56
CPC分类号: H01L23/49503 , H01L21/561 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49586 , H01L23/60 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/131 , H01L2224/1411 , H01L2224/16145 , H01L2224/16245 , H01L2224/17106 , H01L2224/27013 , H01L2224/2919 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48699 , H01L2224/48739 , H01L2224/48839 , H01L2224/4903 , H01L2224/49051 , H01L2224/49109 , H01L2224/49171 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/83051 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012 , H01L2924/206
摘要: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.
摘要翻译: 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 在一个实施例中,引线框架(例如销钉)的部分通过冲压移动离开平台的水平面。 在某些实施例中,可以通过冲压将凹口或复杂的横截面轮廓(例如倒角的)赋予销和/或单面胶带的部分。 由这种冲压的横截面轮廓提供的复杂性用于增强引线框架在封装主体的塑料模制件内的机械互锁。 可以单独使用或组合使用诸如选择性电镀和/或形成棕色氧化物保护带以限制管芯附着期间粘合剂材料扩散的其它技术,以便于制造具有这种冲压特征的封装。
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公开(公告)号:US07667309B2
公开(公告)日:2010-02-23
申请号:US12075814
申请日:2008-03-14
申请人: James Harnden , Allen K. Lam , Richard K. Williams , Anthony Chia , Chu Weibing
发明人: James Harnden , Allen K. Lam , Richard K. Williams , Anthony Chia , Chu Weibing
IPC分类号: H01L23/495 , H01L23/48
CPC分类号: H01L23/49562 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/0603 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49111 , H01L2224/49171 , H01L2224/49431 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/014 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad portion may occupy area at the end or side of the package formerly occupied by non-integral leads. By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die having a larger area, thereby enhancing space efficiency of the package.
摘要翻译: 通过产生用于从设备的接地触点接收下焊线的至少一个补充的下焊垫部分来增强横向导电的半导体器件封装中的空间的有效利用。 补充的底部部分可以占据以前由非整体引线占据的包装的端部或侧面的区域。 通过接收衬底下焊接线,补充的双面部分允许主凹版的更大面积被具有较大面积的模具占据,从而提高了封装的空间效率。
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公开(公告)号:US20090179265A1
公开(公告)日:2009-07-16
申请号:US11944116
申请日:2007-11-21
申请人: James Harnden , Anthony Chia , Liming Wong , Hongbo Yang , Anthony C. Tsui , Hui Teng , Ming Zhou , Lynda Harnden
发明人: James Harnden , Anthony Chia , Liming Wong , Hongbo Yang , Anthony C. Tsui , Hui Teng , Ming Zhou , Lynda Harnden
IPC分类号: H01L27/088 , H01L21/56
CPC分类号: H01M10/44 , H01L2224/48091 , H01L2224/48247 , H01L2924/13091 , H01L2924/3011 , H02J7/0031 , H01L2924/00014 , H01L2924/00
摘要: Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.
摘要翻译: 本发明的实施例涉及用于双向和反向阻断电池开关的改进的管芯布局。 根据一个实施例,两个开关在管芯封装中并排定向,而不是端对端。 该配置降低了给定模具面积的总开关电阻,通常降低电阻以避免使用后金属以满足电阻规格。 消除背面金属可以降低模具封装的整体成本,并消除与后金属制造有关的潜在故障模式。 本发明的实施例还可以允许更多的引脚连接和增加的引脚间距。 这导致用于更高电流连接的冗余连接,从而降低电阻和热阻并且最小化模具封装的制造或实施的成本。
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公开(公告)号:US07553700B2
公开(公告)日:2009-06-30
申请号:US10843867
申请日:2004-05-11
申请人: Hamza Yilmaz , Anthony Chia , Xiaoguang Zeng , Wong Hie Ming , Liming Wang , Yiju Zhang
发明人: Hamza Yilmaz , Anthony Chia , Xiaoguang Zeng , Wong Hie Ming , Liming Wang , Yiju Zhang
IPC分类号: H01L21/44
CPC分类号: H01L23/49548 , H01L21/6835 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L2221/68331 , H01L2224/32245 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package regions of the matrix exposes underlying metal to subsequent chemical etching steps. In an alternative embodiment, a separate photoresist mask may be patterned over the matrix to selectively expose metal in inter-package regions to chemical etching.
摘要翻译: 作为公共矩阵的一部分制造的单个电子封装的分割是通过掩模图案化和化学暴露与物理锯切结合来实现的。 在根据本发明的切割工艺的一个实施例中,切割成基体的封装间区域的初始的浅锯切将下面的金属暴露于随后的化学蚀刻步骤。 在替代实施例中,单独的光致抗蚀剂掩模可以在矩阵上图案化以选择性地将包装区域中的金属暴露于化学蚀刻。
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公开(公告)号:USD588557S1
公开(公告)日:2009-03-17
申请号:US29292225
申请日:2007-10-02
申请人: James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
设计人: James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
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公开(公告)号:USD588080S1
公开(公告)日:2009-03-10
申请号:US29292066
申请日:2007-09-26
申请人: James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
设计人: James Harnden , Anthony Chia , Hongbo Yang , Teng Hui
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公开(公告)号:USD487431S1
公开(公告)日:2004-03-09
申请号:US29173645
申请日:2003-01-03
申请人: James Harnden , Richard K. Williams , Anthony Chia , Chu Weibing , Allen K. Lam
设计人: James Harnden , Richard K. Williams , Anthony Chia , Chu Weibing , Allen K. Lam
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公开(公告)号:USD483337S1
公开(公告)日:2003-12-09
申请号:US29171685
申请日:2002-11-25
申请人: James Harnden , Richard K. Williams , Anthony Chia , Chu Weibing
设计人: James Harnden , Richard K. Williams , Anthony Chia , Chu Weibing
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公开(公告)号:USD467560S1
公开(公告)日:2002-12-24
申请号:US29145233
申请日:2001-07-17
申请人: James Harnden , Richard Williams , Anthony Chia , Chu Weibing
设计人: James Harnden , Richard Williams , Anthony Chia , Chu Weibing
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公开(公告)号:USD461459S1
公开(公告)日:2002-08-13
申请号:US29145235
申请日:2001-07-17
申请人: James Harnden , Richard Williams , Anthony Chia , Chu Weibing
设计人: James Harnden , Richard Williams , Anthony Chia , Chu Weibing
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