发明授权
- 专利标题： Package structure
- 专利标题（中）： 包装结构
-
申请号： US10918416申请日： 2004-08-16
-
公开(公告)号： US07224061B2公开(公告)日： 2007-05-29
- 发明人: Wen-Kun Yang , Shih-Li Chen , Wen-Bin Sun , Ming-Hui Lin , Chao-Nan Chou , Chih-Wei Lin
- 申请人： Wen-Kun Yang , Shih-Li Chen , Wen-Bin Sun , Ming-Hui Lin , Chao-Nan Chou , Chih-Wei Lin
- 申请人地址： TW Hsinchu Hsien
- 专利权人： Advanced Chip Engineering Technology Inc.
- 当前专利权人： Advanced Chip Engineering Technology Inc.
- 当前专利权人地址： TW Hsinchu Hsien
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
公开/授权文献
- US20060033196A1 Package structure 公开/授权日：2006-02-16
信息查询
IPC分类:
