发明授权
US07230309B2 Semiconductor component and sensor component for data transmission devices
有权
用于数据传输设备的半导体元件和传感器元件
- 专利标题： Semiconductor component and sensor component for data transmission devices
- 专利标题（中）： 用于数据传输设备的半导体元件和传感器元件
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申请号： US10956087申请日： 2004-10-04
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公开(公告)号： US07230309B2公开(公告)日： 2007-06-12
- 发明人: Michael Bauer , Thomas Engling , Alfred Haimerl , Joachim Mahler , Wolfgang Schober
- 申请人： Michael Bauer , Thomas Engling , Alfred Haimerl , Joachim Mahler , Wolfgang Schober
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Edell, Shapiro & Finnan, LLC
- 优先权： DE10346474 20031002
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203
摘要：
The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.
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