Invention Grant
- Patent Title: Method of forming silicided gate structure
- Patent Title (中): 形成硅化栅结构的方法
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Application No.: US10846278Application Date: 2004-05-13
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Publication No.: US07241674B2Publication Date: 2007-07-10
- Inventor: Bor-Wen Chan , Jyu-Horng Shieh , Hun-Jan Tao
- Applicant: Bor-Wen Chan , Jyu-Horng Shieh , Hun-Jan Tao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L21/336

Abstract:
A method of forming a silicided gate on a substrate having active regions is provided. The method comprises forming silicide in the active regions and a portion of the gate, leaving a remaining portion of the gate unsilicided; forming a shielding layer over the active regions and gate after the forming step; forming a coating layer over portions of the shielding layer over the active regions; opening the shielding layer to expose the gate, wherein the coating layer protects the portions of the shielding layer over the active regions during the opening step; depositing a metal layer over the exposed gate; and annealing to cause the metal to react with the gate to silicidize at least a part of the remaining portion of the gate.
Public/Granted literature
- US20050253204A1 Method of forming silicided gate structure Public/Granted day:2005-11-17
Information query
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