发明授权
US07244640B2 Method for fabricating a body contact in a Finfet structure and a device including the same
有权
用于在Finfet结构中制造身体接触的方法和包括该身体接触的装置
- 专利标题: Method for fabricating a body contact in a Finfet structure and a device including the same
- 专利标题(中): 用于在Finfet结构中制造身体接触的方法和包括该身体接触的装置
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申请号: US10968229申请日: 2004-10-19
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公开(公告)号: US07244640B2公开(公告)日: 2007-07-17
- 发明人: Kuo-Nan Yang , Yi-Lang Chen , Hou-Yu Chen , Fu-Liang Yang , Chenming Hu
- 申请人: Kuo-Nan Yang , Yi-Lang Chen , Hou-Yu Chen , Fu-Liang Yang , Chenming Hu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method for fabricating a Finfet device with body contacts and a device fabricated using the method are provided. In one example, a silicon-on-insulator substrate is provided. A T-shaped active region is defined in the silicon layer of the silicon-on-insulator substrate. A source region and a drain region form two ends of a cross bar of the T-shaped active region and a body contact region forms a leg of the T-shaped active region. A gate oxide layer is grown on the active region. A polysilicon layer is deposited overlying the gate oxide layer and patterned to form a gate, where an end of the gate partially overlies the body contact region to complete formation of a Finfet device with body contact.
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