Abstract:
A data access device for a communication system includes: a write controller controlled by the host and outputting a write pointer; a read controller controlled by the write pointer and outputting a read pointer; a download timing controller comparing the write and read pointers to determine a timing of downloading data from the host, and including a pointer difference calculator and a comparator, the pointer difference calculator calculating a distance between the write and read pointers to obtain a pointer difference, the comparator outputting a download status indication according to the pointer difference and a first predetermined length to provide a basis for changing the write pointer; and a transmit buffer downloading data from the host according to the write pointer and transmitting data to the network interface according to the read pointer. A data access device for a network interface controller and a data access method are also disclosed.
Abstract:
A network task offload apparatus includes an offload circuit and a buffer scheduler. The offload circuit performs corresponding network task processing on a plurality of packets in parallel according to an offload command. The buffer scheduler includes a buffer control unit and a plurality of buffer units. The plurality of buffer units are controlled by the buffer control unit and are scheduled to store the processed packets.
Abstract:
The disclosure is a network interface controller (NIC) capable of sharing buffers, which is coupled to a host and a network to make the network connection. The NIC includes a transmitting buffer, a transmitting controller, a receiving buffer, and a receiving controller. The transmitting controller controls the transmitting buffer to transmit the transmission data provided by the host to the network. The receiving controller controls the receiving buffer to transmit the reception data received from the network to the host, and determines a storage capacity of the receiving buffer. When the storage capacity is smaller than a set value, the receiving controller transmits a request signal to the transmitting controller, the transmitting controller generates a response signal according to the request signal and a status signal corresponding to the transmitting buffer, and the receiving controller controls whether reception data is stored in the transmitting buffer according to the response signal.
Abstract:
A memory access apparatus is coupled to a memory unit and includes a header access circuit and a payload access circuit. The header access circuit includes a header fetching unit used to fetch a header descriptor in the memory unit, and the payload access circuit includes a payload fetching unit used to fetch a payload descriptor in the memory unit. The header access circuit and the payload access circuit perform fetching with respect to the memory unit in a non-sequenced manner.
Abstract:
A method for fabricating a Finfet device with body contacts and a device fabricated using the method are provided. In one example, a silicon-on-insulator substrate is provided. A T-shaped active region is defined in the silicon layer of the silicon-on-insulator substrate. A source region and a drain region form two ends of a cross bar of the T-shaped active region and a body contact region forms a leg of the T-shaped active region. A gate oxide layer is grown on the active region. A polysilicon layer is deposited overlying the gate oxide layer and patterned to form a gate, where an end of the gate partially overlies the body contact region to complete formation of a Finfet device with body contact.
Abstract:
A data access device for a communication system includes: a write controller controlled by the host and outputting a write pointer; a read controller controlled by the write pointer and outputting a read pointer; a download timing controller comparing the write and read pointers to determine a timing of downloading data from the host, and including a pointer difference calculator and a comparator, the pointer difference calculator calculating a distance between the write and read pointers to obtain a pointer difference, the comparator outputting a download status indication according to the pointer difference and a first predetermined length to provide a basis for changing the write pointer; and a transmit buffer downloading data from the host according to the write pointer and transmitting data to the network interface according to the read pointer. A data access device for a network interface controller and a data access method are also disclosed.
Abstract:
A method of fabricating a double gate, FINFET device structure in a silicon on insulator layer, in which the channel region formed in the SOI layer is defined with a narrowed, or necked shape, and wherein a composite insulator spacer is formed on the sides of the device structure, has been developed. A FINFET device structure shape is formed in an SOI layer via anisotropic RIE procedures, followed by a growth of a silicon dioxide gate insulator layer on the sides of the FINFET device structure shape. A gate structure is fabricated traversing the device structure and overlying the silicon dioxide gate insulator layer located on both sides of the narrowest portion of channel region. After formation of a source/drain region in wider, non-channel regions of the FINFET device structure shape, composite insulator spacers are formed on the sides of the FINFET shape and on the sides of the gate structure. Metal silicide is next formed on source/drain regions resulting in a FINFET device structure featuring a narrow channel region, and surrounded by composite insulator spacers located on the sides of the device structure.
Abstract:
A method of fabricating a double gate, FINFET device structure in a silicon on insulator layer, in which the channel region formed in the SOI layer is defined with a narrowed, or necked shape, and wherein a composite insulator spacer is formed on the sides of the device structure, has been developed. A FINFET device structure shape is formed in an SOI layer via anisotropic RIE procedures, followed by a growth of a silicon dioxide gate insulator layer on the sides of the FINFET device structure shape. A gate structure is fabricated traversing the device structure and overlying the silicon dioxide gate insulator layer located on both sides of the narrowest portion of channel region. After formation of a source/drain region in wider, non-channel regions of the FINFET device structure shape, composite insulator spacers are formed on the sides of the FINFET shape and on the sides of the gate structure. Metal silicide is next formed on source/drain regions resulting in a FINFET device structure featuring a narrow channel region, and surrounded by composite insulator spacers located on the sides of the device structure.
Abstract:
A method for making a SOI wafer with a strained silicon layer for increased electron and hole mobility is achieved. The method forms a porous silicon layer on a seed wafer. A H2 anneal is used to form a smooth surface on the porous silicon. A strain free (relaxed) epitaxial SixGe1−x layer is deposited and a bonding layer is formed. The seed wafer is then bonded to a handle wafer having an insulator on the surface. A spray etch is used to etch the porous Si layer resulting in a SOI handle wafer having portions of the porous Si layer on the relaxed SixGe1−x. The handle wafer is then annealed in H2 to convert the porous Si to a smooth strained Si layer on the relaxed SiGe layer of the SOI wafer.
Abstract:
A new silicon structure is provided. Under a first embodiment of the invention, a first silicon substrate having a crystallographic orientation is bonded to the surface of a second silicon substrate having a crystallographic orientation, the wafer alignment notch of the first and the second silicon substrates are aligned with each other. Under a first embodiment of the invention, a first silicon substrate having a crystallographic orientation is bonded to the surface of a second silicon substrate having a crystallographic orientation, the wafer alignment notch of the first and the second silicon substrates are not aligned with each other.