发明授权
- 专利标题： Method of fabricating rigid-flexible printed circuit board
- 专利标题（中）： 刚性柔性印刷电路板的制造方法
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申请号： US11253973申请日： 2005-10-18
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公开(公告)号： US07281328B2公开(公告)日： 2007-10-16
- 发明人: Yang Je Lee , Dek Gin Yang , Jung Wook Hwang , Kyu Hyok Yim , Jung Hun Chai , Young Ho Lee , Kwang Yune Kim , Dong Gi An
- 申请人： Yang Je Lee , Dek Gin Yang , Jung Wook Hwang , Kyu Hyok Yim , Jung Hun Chai , Young Ho Lee , Kwang Yune Kim , Dong Gi An
- 申请人地址： KR Kyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Kyunggi-Do
- 代理机构： Darby & Darby P.C.
- 优先权： KR10-2004-0086731 20041028
- 主分类号： H01K3/10
- IPC分类号： H01K3/10
摘要：
The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an external pad and a mounting pad is protected from external environments using a resist cover by window etching the base copper foil of a flexible region upon formation of an external circuit pattern as opposed to using a resist cover. Thus the number of fabrication processes and the fabrication costs are decreased and the increase in defect rates due to contamination is prevented, resulting in maximized reliability.
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