公开(公告)号：US07281328B2

公开(公告)日：2007-10-16

申请号：US11253973

申请日：2005-10-18

申请人： Yang Je Lee ,  Dek Gin Yang ,  Jung Wook Hwang ,  Kyu Hyok Yim ,  Jung Hun Chai ,  Young Ho Lee ,  Kwang Yune Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Dek Gin Yang ,  Jung Wook Hwang ,  Kyu Hyok Yim ,  Jung Hun Chai ,  Young Ho Lee ,  Kwang Yune Kim ,  Dong Gi An

IPC分类号： H01K3/10

CPC分类号： H05K3/4691 ,  H05K3/28 ,  H05K3/4652 ,  H05K2201/09127 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an external pad and a mounting pad is protected from external environments using a resist cover by window etching the base copper foil of a flexible region upon formation of an external circuit pattern as opposed to using a resist cover. Thus the number of fabrication processes and the fabrication costs are decreased and the increase in defect rates due to contamination is prevented, resulting in maximized reliability.

摘要翻译： 本发明涉及制造刚挠柔性印刷电路板的方法。 具体地说，本发明涉及一种刚性柔性印刷电路板的制造方法，其中使用外部焊盘和安装焊盘露出的内部电路图案通过窗口蚀刻基底铜而被保护免受外部环境的影响 在形成外部电路图案时，与使用抗蚀剂盖相反，柔性区域的箔片。 因此，制造工艺的数量和制造成本降低，并且防止了由于污染引起的缺陷率的增加，导致最大的可靠性。