A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.