Invention Grant
- Patent Title: Memory cell structure
- Patent Title (中): 存储单元结构
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Application No.: US11093652Application Date: 2005-03-30
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Publication No.: US07312506B2Publication Date: 2007-12-25
- Inventor: Yu-Jen Wang , Chih-Huang Lai , Denny Tang , Wen Chin Lin
- Applicant: Yu-Jen Wang , Chih-Huang Lai , Denny Tang , Wen Chin Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H01L29/82
- IPC: H01L29/82

Abstract:
A memory cell structure. A first conductive line is cladded by at least two first ferromagnetic layers respectively having a first easy axis and a second easy axis, a nano oxide layer located between the first ferromagnetic layers, and a first pinned ferromagnetic layer. The first and second easy axes are 90 degree twisted-coupled with the first easy axis parallel to the length of the first conductive line and the second easy axis perpendicular to the length of the first conductive line. A storage device is adjacent to the first conductive line, receiving a magnetic field generated from a current flowing through the first conductive line.
Public/Granted literature
- US20060233002A1 Memory cell structure Public/Granted day:2006-10-19
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