发明授权
- 专利标题： Semiconductor device with holding member
- 专利标题（中）： 具有保持构件的半导体器件
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申请号： US10420943申请日： 2003-04-23
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公开(公告)号： US07312521B2公开(公告)日： 2007-12-25
- 发明人: Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
- 申请人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Morrison & Foerster LLP
- 优先权： JP2002-120369 20020423; JP2002-185749 20020626
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/12 ; H01L29/70 ; H01L31/02 ; H01L23/04
摘要：
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
公开/授权文献
- US20030230805A1 Semiconductor device and manufacturing method thereof 公开/授权日：2003-12-18