Invention Grant
- Patent Title: Rhodium electroplated structures and methods of making same
- Patent Title (中): 铑电镀结构及其制作方法
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Application No.: US10456343Application Date: 2003-06-06
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Publication No.: US07326327B2Publication Date: 2008-02-05
- Inventor: Michael Armstrong , Gayle Herman , Greg Omweg , Ravindra V. Shenoy
- Applicant: Michael Armstrong , Gayle Herman , Greg Omweg , Ravindra V. Shenoy
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D3/00
Abstract:
A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.
Public/Granted literature
- US20040247920A1 Rhodium Electroplated structures and methods of making same Public/Granted day:2004-12-09
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