公开(公告)号：US07326327B2

公开(公告)日：2008-02-05

申请号：US10456343

申请日：2003-06-06

申请人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

发明人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

IPC分类号： C25D5/02 ,  C25D3/00

CPC分类号： C25D3/54 ,  Y10T428/12 ,  Y10T428/24612 ,  Y10T428/265

摘要： A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

摘要翻译： 将卤化物基应力降低剂加入到镀铑溶液的浴中。 减压剂可减少电镀铑中的应力，增加镀层中不会开裂的铑的厚度。 此外，应力降低剂不会明显降低镀覆铑的耐磨性或硬度。

公开(公告)号：US20080241482A1

公开(公告)日：2008-10-02

申请号：US12026471

申请日：2008-02-05

申请人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

发明人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

IPC分类号： B32B3/00

CPC分类号： C25D3/54 ,  Y10T428/12 ,  Y10T428/24612 ,  Y10T428/265

摘要： A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

摘要翻译： 将卤化物基应力降低剂加入到镀铑溶液的浴中。 减压剂可减少电镀铑中的应力，增加可镀而不开裂的铑的厚度。 此外，应力降低剂不会显着降低镀覆铑的耐磨性或硬度。