Invention Grant
- Patent Title: Photoresist compositions
- Patent Title (中): 光刻胶组合物
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Application No.: US11287104Application Date: 2005-11-23
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Publication No.: US07326518B2Publication Date: 2008-02-05
- Inventor: James F. Cameron , Dong Woo Lee , Peter Trefonas, III , Gary J. Swanson , Jin Wuk Sung
- Applicant: James F. Cameron , Dong Woo Lee , Peter Trefonas, III , Gary J. Swanson , Jin Wuk Sung
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agency: Edwards Angell Palmer Dodge LLP
- Agent Peter F. Corless; Darryl P. Frickey
- Main IPC: G03C1/492
- IPC: G03C1/492 ; G03C1/494 ; G03C1/76 ; G03C5/00

Abstract:
Chemically-amplified positive photoresist compositions are provided that contain a resin that comprises acetal and alicyclic groups. Photoresists of the invention can exhibit notably enhanced lithographic properties. Preferred photoresists of the invention comprise one or more photoacid generator compounds and one or more phenolic resins comprise one or more photoacid-labile acetal groups and one or more alicyclic groups such as adamantyl.
Public/Granted literature
- US20060172224A1 Photoresist compositions Public/Granted day:2006-08-03
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