Invention Grant
US07331307B2 Thermally sprayed member, electrode and plasma processing apparatus using the electrode
有权
使用电极的热喷涂部件，电极和等离子体处理装置
- Patent Title: Thermally sprayed member, electrode and plasma processing apparatus using the electrode
- Patent Title (中): 使用电极的热喷涂部件，电极和等离子体处理装置
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Application No.: US11055058Application Date: 2005-02-11
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Publication No.: US07331307B2Publication Date: 2008-02-19
- Inventor: Daisuke Hayashi
- Applicant: Daisuke Hayashi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2004-037094 20040213
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/50 ; C23C16/503 ; H01L21/306 ; H01L21/3065
Abstract:
A thermally sprayed member or an electrode includes a basic material, a thermally sprayed film formed on the surface of the basic material, the thermally sprayed film being made of an insulating ceramic and a metallic intermediate layer provided between the basic material and the thermally sprayed film for increasing a bonding force therebetween, wherein the thermally sprayed film side of the member is exposed to a high frequency plasma atmosphere and the electrode is intended to form a high frequency plasma on the side of the thermally sprayed film. The basic material includes a base portion made of a conductive material and a dielectric portion provided to include a part of a surface of the basic material. Further, the intermediate layer is comprised of a plurality of island-shaped parts isolated from each other.
Public/Granted literature
- US20050211384A1 Thermally sprayed member, electrode and plasma processing apparatus using the electrode Public/Granted day:2005-09-29
Information query
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