发明授权
- 专利标题: Stacked die in die BGA package
- 专利标题(中): 堆叠模具在模具BGA封装
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申请号: US10424426申请日: 2003-04-28
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公开(公告)号: US07332820B2公开(公告)日: 2008-02-19
- 发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
- 申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Whyte Hirschboeck Dudek SC
- 优先权: SG200200134-5 20020109
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.
公开/授权文献
- US20030207515A1 Stacked die in die BGA package 公开/授权日:2003-11-06