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公开(公告)号：US08373277B2
公开(公告)日：2013-02-12
申请号：US12020738
申请日：2008-01-28
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号： H01L23/12
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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公开(公告)号：US07282392B2
公开(公告)日：2007-10-16
申请号：US11511956
申请日：2006-08-29
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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公开(公告)号：US07358117B2
公开(公告)日：2008-04-15
申请号：US11511941
申请日：2006-08-29
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号： H01L21/44
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造用于增加半导体器件密度的器件和组件的方法。
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公开(公告)号：US07344969B2
公开(公告)日：2008-03-18
申请号：US10424470
申请日：2003-04-28
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号： H01L23/48
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.
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公开(公告)号：US07282390B2
公开(公告)日：2007-10-16
申请号：US11440913
申请日：2006-05-25
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. In an embodiment of the methods, a second die is mounted on a first die which is at least partially received within a recess of the second die and an overall height of the dies within the device is less than a combined height of the dies.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造器件和组件的方法。 在所述方法的一个实施例中，第二管芯安装在第一管芯上，所述第一管芯至少部分地容纳在第二管芯的凹部内，并且器件内的管芯的整体高度小于管芯的组合高度。
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6.发明授权公开(公告)号：US07371608B2
公开(公告)日：2008-05-13
申请号：US10389433
申请日：2003-03-14
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造用于增加半导体器件密度的器件和组件的方法。
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7.发明授权公开(公告)号：US07799610B2
公开(公告)日：2010-09-21
申请号：US11872489
申请日：2007-10-15
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造器件和组件的方法。
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公开(公告)号：US07332819B2
公开(公告)日：2008-02-19
申请号：US10068159
申请日：2002-02-05
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号： H01L23/48
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with a recessed edge portion along a perimeter of that die, and the recessed edge portion having a height sufficient for clearance of bonding elements extending from the first die.
摘要翻译： 提供半导体器件和堆叠管芯组件，其具有以堆叠方式设置在衬底上的至少两个半导体管芯，第一和第二管芯具有第一表面，具有接合焊盘，第二管芯具有第二表面，沿着 该模具的周边，并且凹入的边缘部分具有足以使从第一模具延伸的结合元件的间隙的高度。
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公开(公告)号：US07309623B2
公开(公告)日：2007-12-18
申请号：US11511653
申请日：2006-08-29
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造用于增加半导体器件密度的器件和组件的方法。
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公开(公告)号：US07575953B2
公开(公告)日：2009-08-18
申请号：US11959013
申请日：2007-12-18
申请人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人： Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号： H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译： 提供半导体器件和堆叠管芯组件，以及制造用于增加半导体器件密度的器件和组件的方法。
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