Invention Grant
- Patent Title: Temperature and voltage controlled integrated circuit processes
- Patent Title (中): 温控电压集成电路
-
Application No.: US10882905Application Date: 2004-06-30
-
Publication No.: US07345495B2Publication Date: 2008-03-18
- Inventor: Daniel J. Dangelo , Todd P. Albertson , Hon Lee Kon , Jin Pan
- Applicant: Daniel J. Dangelo , Todd P. Albertson , Hon Lee Kon , Jin Pan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/28

Abstract:
The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each to hold an integrated circuit (IC), and coupling power to the respective IC from a remote power supply, a plurality of voltage detectors, each coupled to a socket to sense the voltage of the power coupled to the respective IC, and a plurality of remote voltage regulators, each coupled between the power supply and a respective socket, to receive the sensed voltage from the respective voltage detector and to adjust the voltage of the respective coupled power in accordance therewith.
Public/Granted literature
- US20060002161A1 Temperature and voltage controlled integrated circuit processes Public/Granted day:2006-01-05
Information query