发明授权
- 专利标题： Copper clad laminate
- 专利标题（中）： 覆铜层压板
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申请号： US09925740申请日： 2001-08-10
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公开(公告)号： US07358189B2公开(公告)日： 2008-04-15
- 发明人: Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
- 申请人： Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
- 申请人地址： JP Tokyo
- 专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权： JP2000-255490 20000825
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
公开/授权文献
- US20020041032A1 Copper clad laminate 公开/授权日：2002-04-11
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