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12 条记录 (耗时 0.016 秒)

    Copper foil and method of manufacturing the same
    7.
    发明授权
    Copper foil and method of manufacturing the same 失效
    铜箔及其制造方法

    公开(公告)号：US07749610B2

    公开(公告)日：2010-07-06

    申请号：US11547517

    申请日：2005-03-31

    申请人： Kenichiro Iwakiri ,  Seiji Nagatani

    发明人： Kenichiro Iwakiri ,  Seiji Nagatani

    IPC分类号： B32B15/20 ,  C25D7/06 ,  C25D3/38 ,  H05K1/09

    CPC分类号： C25D7/06 ,  H05K3/382 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12993

    摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S)  (1) where Rz(S) is a numerical value represented by μm.

    摘要翻译： 本发明的目的是提供铜箔的结节面的粗糙度Rz低的高粘合性的铜箔及其制造方法。 为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中 通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得， 通过触针式粗糙度计测量的铜箔样品S的结节面的尺寸表面积A（S）和粗糙度Rz（S）具有以下等式（1）的关系，并且因此 粗糙度Rz（S）为1.0μm〜3.0μm，0.5×Rz（S）+ 0.5＆amp; NlE; C（S）（1）其中，Rz（S）为由μm表示的数值。

    Electrodeposited copper foil with carrier foil
    8.
    发明授权
    Electrodeposited copper foil with carrier foil 有权
    带有载体箔的电沉积铜箔

    公开(公告)号：US07691487B2

    公开(公告)日：2010-04-06

    申请号：US10488275

    申请日：2003-06-27

    申请人： Seiji Nagatani

    发明人： Seiji Nagatani

    IPC分类号： B32B15/08 ,  H05K1/09 ,  H05K3/38 ,  C25D1/20

    CPC分类号： H05K3/025 ,  C25D1/04 ,  H05K3/384 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12535 ,  Y10T428/12569 ,  Y10T428/1291

    摘要： The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

    摘要翻译： 本发明提供具有载体箔的电沉积铜箔，其允许形成更细的节距电路，并且还使得能够容易地执行多层工艺以满足最近的印刷线路板的要求。 根据本发明，提供了具有载体箔的电沉积铜箔，其中在载体箔的表面上形成粘合界面层，并且在粘合界面层上形成电沉积铜箔层，其特征在于， 电沉积铜箔层设置有钝化层，而不进行粗化处理，作为结节处理，并且采用基本上由50重量％至99重量％的镍和50至1重量％的锌组成的镍锌合金作为钝化层。