发明授权
US07363698B2 Process for creating a write head by forming a bump after the top pole is formed
失效
用于通过在形成顶极之后形成凸起来产生写入头的过程
- 专利标题： Process for creating a write head by forming a bump after the top pole is formed
- 专利标题（中）： 用于通过在形成顶极之后形成凸起来产生写入头的过程
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申请号： US10956221申请日： 2004-09-30
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公开(公告)号： US07363698B2公开(公告)日： 2008-04-29
- 发明人: Amanda Baer , Hamid Balamane , Daniel Wayne Bedell , Jyh-Shuey Jerry Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
- 申请人： Amanda Baer , Hamid Balamane , Daniel Wayne Bedell , Jyh-Shuey Jerry Lo , Vladimir Nikitin , Aron Pentek , Yvette Winton
- 申请人地址： NL
- 专利权人： Hitachi Gobal Storage Technologies Inc.
- 当前专利权人： Hitachi Gobal Storage Technologies Inc.
- 当前专利权人地址： NL
- 主分类号： G11B5/127
- IPC分类号： G11B5/127 ; H04R31/00
摘要：
Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.
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