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    Method for manufacturing a magnetic read sensor with narrow track width using amorphous carbon as a hard mask and localized CMP
    1.
    发明授权
    Method for manufacturing a magnetic read sensor with narrow track width using amorphous carbon as a hard mask and localized CMP 有权
    使用无定形碳作为硬掩模和局部化CMP制造具有窄轨道宽度的磁读取传感器的方法

    公开(公告)号：US08617408B2

    公开(公告)日：2013-12-31

    申请号：US13275728

    申请日：2011-10-18

    申请人： Hamid Balamane ,  Patrick M. Braganca ,  Jordan A. Katine ,  Jui-Lung Li ,  Yang Li ,  Kanaiyalal C. Patel ,  Neil L. Robertson ,  Samuel W. Yuan

    发明人： Hamid Balamane ,  Patrick M. Braganca ,  Jordan A. Katine ,  Jui-Lung Li ,  Yang Li ,  Kanaiyalal C. Patel ,  Neil L. Robertson ,  Samuel W. Yuan

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3163 ,  G01R33/093 ,  G11B5/3169 ,  G11B5/398

    摘要： A method for manufacturing a magnetic read sensor at very narrow track widths. The method uses an amorphous carbon mask layer to pattern the sensor by ion milling, rather than a mask constructed of a material such as photoresist or DURIMIDE® which can bend over during ion milling at very narrow track widths. By using the amorphous carbon layer as the masking layer, the trackwidth can be very small, while avoiding this bending over of the mask that has been experienced with prior art methods. In addition, the track-width can be further reduced by using a reactive ion etching to further reduce the width of the amorphous carbon mask prior to patterning the sensor. The method also allows extraneous portions of the side insulation layer and hard bias layer to be removed above the sensor by a light CMP process.

    摘要翻译： 一种以非常窄的轨道宽度制造磁读取传感器的方法。 该方法使用无定形碳掩模层通过离子研磨对传感器进行图案化，而不是由诸如光致抗蚀剂或DURIMIDE的材料构成的掩模，其可以在非常窄的轨道宽度的离子铣削过程中弯曲。 通过使用无定形碳层作为掩蔽层，轨道宽度可以非常小，同时避免了现有技术方法经历的掩模的弯曲。 此外，通过使用反应离子蚀刻，在图案化传感器之前进一步减小无定形碳掩模的宽度，可以进一步减小轨道宽度。 该方法还允许通过光CMP工艺在传感器上方去除侧绝缘层和硬偏置层的外部部分。

    Process to open connection vias on a planarized surface
    2.
    发明申请
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号：US20070245557A1

    公开(公告)日：2007-10-25

    申请号：US11411555

    申请日：2006-04-25

    申请人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    发明人： Amanda Baer ,  Hamid Balamane ,  Michael Feldbaum ,  Ming Jiang ,  Aron Pentek

    IPC分类号： H01K3/10

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

    摘要： A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer. The mask can then be lifted off and an electrically conductive material can be deposited into the via. Forming the via by a subtractive method rather than by a liftoff process allows the alumina to be deposited in a manner that does not result in voids. The use of reactive ion milling allows the via to be well defined and formed with substantially vertical side walls rather than in a conical or outward spreading fashion as would be formed by other material removal processes such as wet etching.

    摘要翻译： 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 在其中形成有形成有接触垫的区域形成诸如氧化铝填充层，磁性成形层等的基板。 诸如磁极和/或磁性后屏蔽的结构形成在衬底之上，并被厚层氧化铝覆盖。 可以通过在氧化铝层中不形成空隙或接缝的高沉积速率工艺来施加氧化铝。 然后可以通过化学机械抛光工艺（CMP）将氧化铝层平坦化，然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层，从而在氧化铝层中形成通孔。 然后可以将掩模剥离，并且可以将导电材料沉积到通孔中。 通过减法法而不是通过剥离工艺形成通孔允许以不会导致空隙的方式沉积氧化铝。 使用反应离子研磨允许通孔被良好地限定并且形成有基本垂直的侧壁，而不是以其它材料去除工艺（例如湿蚀刻）形成的锥形或向外扩展方式。

    Write head design and method for reducing adjacent track interference in at very narrow track widths
    3.
    发明申请
    Write head design and method for reducing adjacent track interference in at very narrow track widths 有权
    用于在非常窄的轨道宽度上减少相邻轨道干扰的写头设计和方法

    公开(公告)号：US20070115584A1

    公开(公告)日：2007-05-24

    申请号：US11286077

    申请日：2005-11-23

    申请人： Hamid Balamane ,  Yimin Hsu ,  Aron Pentek ,  Yi Zheng

    发明人： Hamid Balamane ,  Yimin Hsu ,  Aron Pentek ,  Yi Zheng

    IPC分类号： G11B5/147

    CPC分类号： G11B5/3163 ,  G11B5/112 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/3146 ,  G11B5/315 ,  Y10T29/49021

    摘要： A perpendicular write head having a wrap around trailing shield for reducing stray field writing and adjacent track interference. A method for constructing such a write head allows for excellent control of side shield gap thickness and trailing shield gap thickness, and allows the ratio of side gap to trailing gap thicknesses to be maintained at about two to one as desired. The method includes depositing forming a write pole by constructing a mask which may include a bi-layer hard mask, and then ion milling to form the write pole. Once the write pole has been formed, a layer of alumina or some other non-magnetic material can be conformally deposited. A reactive ion mill (RIM) can be performed to open up the top of the write pole (remove the horizontally disposed portions of the alumina layer). Then, a second layer of alumina or some other non-magnetic material can be deposited, and the write pole can be plated. The thickness of the side shield gaps is defined by the sum of the final thicknesses of the first and second alumina layers, while the thickness of the first magnetic layer defines the thickness of the trailing shield gap.

    摘要翻译： 垂直写头，其具有围绕后屏蔽的卷绕，用于减少杂散场写入和相邻轨道干涉。 用于构造这样的写头的方法允许对侧屏蔽间隙厚度和后屏蔽间隙厚度的优良控制，并且允许侧间隙与后间隙厚度的比率根据需要保持在大约二对一。 该方法包括通过构成可包括双层硬掩模的掩模沉积形成写入极，然后进行离子铣削以形成写入极。 一旦形成了写极，就可以共形沉积一层氧化铝或其它非磁性材料。 可以执行反应离子磨（RIM）以打开写柱的顶部（去除氧化铝层的水平放置的部分）。 然后，可以沉积第二层氧化铝或一些其它非磁性材料，并且可以对写入极进行电镀。 侧屏蔽间隙的厚度由第一和第二氧化铝层的最终厚度之和限定，而第一磁性层的厚度限定了后屏蔽间隙的厚度。

    Thermally assisted recording head with near field transducer having integral heatsink
    5.
    发明授权
    Thermally assisted recording head with near field transducer having integral heatsink 有权
    具有集成散热片的近场传感器的热辅助记录头

    公开(公告)号：US08339739B2

    公开(公告)日：2012-12-25

    申请号：US12807296

    申请日：2010-08-31

    申请人： Hamid Balamane ,  Jordan Asher Katine ,  Neil Leslie Robertson ,  Barry Cushing Stipe

    发明人： Hamid Balamane ,  Jordan Asher Katine ,  Neil Leslie Robertson ,  Barry Cushing Stipe

    IPC分类号： G11B5/187

    CPC分类号： G11B5/314 ,  G11B5/3136 ,  G11B5/6088 ,  G11B2005/0021

    摘要： A write head structure for use with thermally assisted recording is disclosed. Improved heat sinking is provided for removing thermal energy created by a ridge aperture near field light transducer. Metal films conduct heat away from the region near the ridge aperture to the high pressure air film at the ABS between the head and media. This heat is further dissipated by the media. The metal films have varying thickness to improve lateral conductivity and may be composed of Au combined with a harder metal such as Ru to improve wear characteristics at the ABS.

    摘要翻译： 公开了一种用于热辅助记录的写头结构。 提供改进的散热用于去除由场光传感器附近的脊孔产生的热能。 金属膜将热量从脊孔附近的区域传导到头部和介质之间的ABS处的高压空气膜。 这种热量被介质进一步消散。 金属膜具有不同的厚度以改善横向导电性，并且可以由Au与诸如Ru的较硬金属组合以提高ABS的磨损特性。

    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same
    6.
    发明授权
    Thermally assisted recording head having recessed waveguide with near field transducer and methods of making same 有权
    带有近场传感器的凹槽波导的热辅助记录头及其制造方法

    公开(公告)号：US08169881B2

    公开(公告)日：2012-05-01

    申请号：US12347084

    申请日：2008-12-31

    申请人： Hamid Balamane ,  Thomas Dudley Boone, Jr. ,  Neil Leslie Robertson ,  Barry Cushing Stipe ,  Timothy Carl Strand

    发明人： Hamid Balamane ,  Thomas Dudley Boone, Jr. ,  Neil Leslie Robertson ,  Barry Cushing Stipe ,  Timothy Carl Strand

    IPC分类号： G11B7/135

    CPC分类号： G11B5/3163 ,  G11B5/314 ,  G11B5/6088 ,  G11B2005/0021

    摘要： According to one embodiment, an apparatus includes a near field transducer comprising a conductive metal film having a main body and a ridge extending from the main body and an optical waveguide for illumination of the near field transducer, a light guiding core layer of the optical waveguide being spaced from the near field transducer by less than about 100 nanometers and greater than 0 nanometers. In another embodiment, a method includes forming a near field transducer structure and removing a portion of the near field transducer structure. The method also includes forming a cladding layer adjacent a remaining portion of the near field transducer structure, wherein a portion of the cladding layer extends along the remaining portion of the near field transducer structure and forming a core layer above the cladding layer. Other apparatuses and methods are also included in the invention.

    摘要翻译： 根据一个实施例，一种装置包括近场换能器，其包括具有主体和从主体延伸的脊的导电金属膜和用于照射近场换能器的光波导，光波导的导光芯层 与近场传感器间隔小于约100纳米且大于0纳米。 在另一实施例中，一种方法包括形成近场换能器结构并去除近场换能器结构的一部分。 该方法还包括在近场换能器结构的剩余部分附近形成包覆层，其中包层的一部分沿着近场换能器结构的剩余部分延伸并在包层上方形成芯层。 本发明还包括其他装置和方法。

    Method of laser cutting a metal line on an MR head with a laser
    9.
    发明授权
    Method of laser cutting a metal line on an MR head with a laser 失效
    用激光切割MR头上的金属线的方法

    公开(公告)号：US06049056A

    公开(公告)日：2000-04-11

    申请号：US4693

    申请日：1998-01-08

    申请人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    发明人： Hamid Balamane ,  Chie Ching Poon ,  Neil Leslie Robertson ,  Andrew Ching Tam

    IPC分类号： B23K26/40 ,  B23K26/08

    CPC分类号： B23K26/40 ,  B23K26/362 ,  B23K2203/26 ,  B23K2203/50 ,  Y10T29/49032

    摘要： A thin film conductive line is formed between MR pads on an MR head for protecting an MR sensor from electrostatic discharge (ESD) during assembly steps between row level fabrication of the head and prior to merge of a head stack assembly with a disk stack assembly. The conductive line may have a reduced thickness delete pad. A laser beam having a fluence sufficient to sever the conductive line at the delete pad but insufficient to damage or cause debris from structure underlying or surrounding the conductive line is used to sever the conductive line. The method traverses minimum energy, short laser pulses at a high pulse rate across the line, the melted material withdrawing from the melted area and being heaped on top of adjacent portions of the delete pad by surface tension and the melted material cooling to room temperature before the next pulse so that there is no cumulative heating and therefore no damage to or debris from the underlying structure. The conductive material of the line is incrementally plowed to each side of a severed path by successive overlapping laser pulses so that when the series of laser pulses has traversed the width of the delete pad the conductive line has been severed.

    摘要翻译： 在MR头上的MR焊盘之间形成薄膜导电线，用于在磁头堆叠组件与磁盘堆叠组件合并之前的组装步骤期间保护MR传感器免受静电放电（ESD）的影响。 导线可以具有减小的厚度删除焊盘。 激光束具有足够的能量来切断在删除焊盘处的导线，但是不足以损坏或者导致来自导电线下面或周围的结构的碎屑被切断导线。 该方法穿过线路以高脉冲速度穿过最小能量，短激光脉冲，熔化的材料从熔化区域退出，并通过表面张力堆积在删除焊盘的相邻部分的顶部，并将熔融的材料冷却至室温 下一个脉冲，使得没有累积加热，因此没有来自底层结构的损坏或碎屑。 线的导电材料通过连续重叠的激光脉冲逐渐地被切割到切断路径的每一侧，使得当一系列激光脉冲已经穿过删除焊盘的宽度时，导线已被切断。

    CPP sensors with hard bias structures that shunt sense current towards a shield
    10.
    发明授权
    CPP sensors with hard bias structures that shunt sense current towards a shield 有权
    具有硬偏压结构的CPP传感器将屏蔽层的感应电流分流

    公开(公告)号：US08335056B2

    公开(公告)日：2012-12-18

    申请号：US11957466

    申请日：2007-12-16

    申请人： Hamid Balamane ,  Jeffrey R. Childress ,  Robert E. Fontana, Jr. ,  Jordan A. Katine ,  Neil Smith

    发明人： Hamid Balamane ,  Jeffrey R. Childress ,  Robert E. Fontana, Jr. ,  Jordan A. Katine ,  Neil Smith

    IPC分类号： G11B5/39

    CPC分类号： G11B5/3932 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/3912 ,  G11B2005/3996

    摘要： Read sensors and associated methods of fabrication are disclosed. A read sensor as disclosed herein includes a first shield, a sensor stack including an antiparallel (AP) free layer, and insulating material disposed on the sensor stack. A aperture is formed through the insulating material above the sensor stack so that a subsequently deposited second shield is electrically coupled to the sensor stack through the aperture. The width of the aperture controls the current density that is injected into the top of the sensor stack. Also, hard bias structures may be formed to be electrically coupled to the sensor stack. The electrical coupling of the sensor stack and the hard bias structures allows current to laterally spread out as it passes through the sensor stack, and hence, provides a non-uniform current density.

    摘要翻译： 公开了传感器和相关的制造方法。 本文公开的读取传感器包括第一屏蔽层，包括反平行（AP）自由层的传感器堆叠以及设置在传感器堆叠上的绝缘材料。 通过传感器堆叠上方的绝缘材料形成孔，使得随后沉积的第二屏蔽件通过孔电耦合到传感器堆叠。 光圈的宽度控制注入到传感器叠层顶部的电流密度。 此外，可以形成硬偏置结构以电耦合到传感器堆叠。 传感器堆叠和硬偏置结构的电耦合允许电流在其通过传感器堆叠时横向展开，因此提供不均匀的电流密度。