发明授权
- 专利标题： Electrical wiring structure, manufacturing method thereof, electro-optical device substrate having electrical wiring structure, electro-optical device, and manufacturing method thereof
- 专利标题（中）： 电气布线结构，其制造方法，具有电布线结构的电光装置基板，电光装置及其制造方法
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申请号： US10833258申请日： 2004-04-27
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公开(公告)号： US07371972B2公开(公告)日： 2008-05-13
- 发明人: Satoshi Taguchi , Kazuo Oike , Hideki Uehara , Katsuhiro Imai , Chihiro Tanaka
- 申请人： Satoshi Taguchi , Kazuo Oike , Hideki Uehara , Katsuhiro Imai , Chihiro Tanaka
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2003-126569 20030501; JP2003-126570 20030501
- 主分类号： H01R12/14
- IPC分类号： H01R12/14
摘要：
An electrical wiring structure is provided which can be formed simultaneously when non-linear elements containing corrosion resistant metal wires and non-corrosion resistant metal wires are formed. In addition, a manufacturing method of the electrical wiring structure, an electro-optical device substrate provided with the electrical wiring structure, an electro-optical device, and a manufacturing method thereof are also provided. In particular, an oxide layer and the non-corrosion resistant metal wire are sequentially formed on a surface of the corrosion resistant metal wire. An exposed portion of the corrosion resistant metal wire is formed by removing part of the oxide layer. An electrical connection auxiliary member, such as a through-hole formed at the exposed portion or a conductive inorganic oxide film formed on the corrosion resistant metal wire and the exposed portion, is formed to electrically connect the corrosion resistant metal wire and the non-corrosion resistant metal wire.