发明授权
- 专利标题: Strained-channel semiconductor structure and method for fabricating the same
- 专利标题(中): 应变通道半导体结构及其制造方法
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申请号: US11423457申请日: 2006-06-12
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公开(公告)号: US07381604B2公开(公告)日: 2008-06-03
- 发明人: Chun-Chieh Lin , Yee-Chia Yeo
- 申请人: Chun-Chieh Lin , Yee-Chia Yeo
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Thomas, Kayden, Horstemeyer & Risley
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A strained-channel semiconductor structure and method of fabricating the same. The strained-channel semiconductor structure comprises a substrate composed of a first semiconductor material with a first natural lattice constant. A channel region is disposed in the substrate and a gate stack is disposed over the strained channel region. A pair of source/drain regions are oppositely disposed in the substrate adjacent to the channel region, wherein each of the source/drain regions comprises a lattice-mismatched zone comprising a second semiconductor material with a second natural lattice constant rather than the first natural lattice constant, an inner side and an outer side corresponding to the gate stack, and at least one outer sides laterally contacts the first semiconductor material of the substrate.
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