发明授权
- 专利标题： Semiconductor device and a manufacturing method of the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11482764申请日： 2006-07-10
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公开(公告)号： US07399694B2公开(公告)日： 2008-07-15
- 发明人: Takashi Kikuchi , Koichi Kanemoto , Michiaki Sugiyama , Hiroshi Kawakukbo
- 申请人： Takashi Kikuchi , Koichi Kanemoto , Michiaki Sugiyama , Hiroshi Kawakukbo
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Miles & Stockbridge P.C.
- 优先权： JP2005-205027 20050714
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.
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