公开(公告)号：US20080254574A1

公开(公告)日：2008-10-16

申请号：US12141074

申请日：2008-06-17

申请人： Takashi KIKUCHI ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

发明人： Takashi KIKUCHI ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

IPC分类号： H01L21/60

CPC分类号： H05K1/111 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/043 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in the location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.

摘要翻译： 通过制备具有多个NSMD结构的焊盘的封装衬底，以及连接到每个焊盘并且以180°对称的位置相互布置的输出布线和虚拟布线，以及通过印刷印刷焊料 方法到封装组装后的焊盘上，可以降低焊盘之间的焊料层高度的变化，并且实现了LGA（半导体器件）的安装性能的提高。

公开(公告)号：US07399694B2

公开(公告)日：2008-07-15

申请号：US11482764

申请日：2006-07-10

申请人： Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

发明人： Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K1/111 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/043 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.

摘要翻译： 通过制备具有多个NSMD结构的焊盘的封装衬底以及连接到每个焊盘并且已经以180度对称的位置相互布置的输出布线和虚拟布线，以及通过印刷方法印刷焊料 在封装组装之后的焊盘上的焊接层的高度的变化可以减小，并且实现了LGA（半导体器件）的安装性能的提高。