发明授权
- 专利标题： Droplet discharge apparatus
- 专利标题（中）： 滴液排放装置
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申请号： US11197835申请日： 2005-08-05
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公开(公告)号： US07401885B2公开(公告)日： 2008-07-22
- 发明人: Shunpei Yamazaki , Osamu Nakamura
- 申请人： Shunpei Yamazaki , Osamu Nakamura
- 申请人地址： JP
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Cook, Alex, McFarron, Manzo, Cummings & Mehler, Ltd.
- 优先权： JP2004-242862 20040823
- 主分类号： B41J2/015
- IPC分类号： B41J2/015 ; B41J2/14 ; B41J2/175
摘要：
An object of the invention is to provide a droplet discharge apparatus which does not cause defective discharge due to drying, solidification, or the like of a composition in discharging the composition from a nozzle. One feature of the invention is to comprise a nozzle portion provided with a nozzle hole for discharging a composition, a piezo method for discharging the composition from the nozzle hole, a channel for supplying the composition to the bottom surface of the nozzle portion, wherein lyophilic treatment is performed on the bottom surface of the nozzle portion.
公开/授权文献
- US20060028503A1 Droplet discharge apparatus 公开/授权日：2006-02-09
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