发明授权
- 专利标题： IC chip package with cover
- 专利标题（中）： IC芯片封装封装
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申请号： US11262907申请日： 2005-10-31
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公开(公告)号： US07417327B2公开(公告)日： 2008-08-26
- 发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
- 申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
- 申请人地址： TW Miao-Li Hsien
- 专利权人： Altus Technology Inc.
- 当前专利权人： Altus Technology Inc.
- 当前专利权人地址： TW Miao-Li Hsien
- 代理机构： Morris Manning Martin LLP
- 代理商 Tim Tingkang Xia, Esq.
- 优先权： TW93133742A 20041105
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/02 ; H01L23/12
摘要：
An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.
公开/授权文献
- US20060097405A1 IC chip package and method for packaging same 公开/授权日：2006-05-11
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