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公开(公告)号:US07365421B2
公开(公告)日:2008-04-29
申请号:US11262876
申请日:2005-10-31
申请人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
CPC分类号: H01L23/49827 , H01L23/055 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要: An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads (3) arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias (4) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads (51) arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.
摘要翻译: IC芯片封装包括基板(2),芯片(5),多个接合线(52)和盖(6)。 衬底具有顶表面,在顶表面具有开口的接收室(23),围绕顶表面布置的多个焊盘(3),并且分别对应于布置在与顶部相对的底表面处的焊盘 表面以及具有导电材料的多个通孔(4),其将顶部焊盘与其中限定的底部焊盘电连接。 芯片安装在接收室中,并且具有围绕其顶表面布置的多个芯片焊盘(51)。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面,并且覆盖开口。
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2.
公开(公告)号:US20060290802A1
公开(公告)日:2006-12-28
申请号:US11402467
申请日:2006-04-12
申请人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
发明人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
IPC分类号: H04N5/225
CPC分类号: H04N5/2253 , H04N5/2254
摘要: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
摘要翻译: 数码相机模块(200)包括透镜保持器(20),容纳在透镜保持器中的透镜模块(30)和安装到透镜保持器的图像传感器芯片封装(40)。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒(301)和容纳在镜筒中的至少一个透镜(302)。 图像传感器芯片封装包括基座(401),安装在基座上的图像传感器芯片(402),透明盖(405)和相对于图像传感器芯片定位透明盖的粘合剂(50)。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。
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公开(公告)号:US20060093352A1
公开(公告)日:2006-05-04
申请号:US11262592
申请日:2005-10-31
申请人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号: G03B17/00
CPC分类号: H04N5/2254 , G02B7/025 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H04N5/2253 , H01L2924/00014
摘要: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.
摘要翻译: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装(2)和透镜镜筒(30)。 图像传感器封装包括基板(20),图像传感器芯片(22)和盖子(28)。 衬底在其中限定接收室(203)。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部,从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分(29)。 镜筒包括容纳在其中的至少一个透镜(31)。 透镜筒牢固地附接到基板的顶部的未覆盖部分。
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4.
公开(公告)号:US07643081B2
公开(公告)日:2010-01-05
申请号:US11402467
申请日:2006-04-12
申请人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
发明人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
IPC分类号: H04N5/225
CPC分类号: H04N5/2253 , H04N5/2254
摘要: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
摘要翻译: 数码相机模块(200)包括透镜保持器(20),容纳在透镜保持器中的透镜模块(30)和安装到透镜保持器的图像传感器芯片封装(40)。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒(301)和容纳在镜筒中的至少一个透镜(302)。 图像传感器芯片封装包括基座(401),安装在基座上的图像传感器芯片(402),透明盖(405)和相对于图像传感器芯片定位透明盖的粘合剂(50)。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。
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公开(公告)号:US07417327B2
公开(公告)日:2008-08-26
申请号:US11262907
申请日:2005-10-31
申请人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
CPC分类号: H01L23/055 , H01L23/10 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.
摘要翻译: IC(集成电路)芯片封装包括基板(2),芯片(3),多个接合线(32)和盖(5)。 衬底具有顶表面,底表面,限定在其中的接收室(23),围绕顶表面和底表面布置的多个焊盘(24),以及多个通孔(25),其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中,并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口,并且具有比基板更小的轮廓,从而不覆盖顶表面的周边区域。
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公开(公告)号:US20080095529A1
公开(公告)日:2008-04-24
申请号:US11617070
申请日:2006-12-28
申请人: PO-CHIH HSU , MING-YUAN LIN
发明人: PO-CHIH HSU , MING-YUAN LIN
IPC分类号: G03B17/00
CPC分类号: G03B17/28 , H04N5/2251 , H04N5/2257
摘要: A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.
摘要翻译: 数码相机模块封装(200)包括基座(20),图像传感器芯片封装(21)和透镜模块(22)。 图像传感器芯片封装安装在基座上。 透镜模块包括空腔(257)。 空腔适合接收图像传感器芯片封装,并且压靠图像传感器芯片封装的圆周壁。 数码相机模块包可以将图像传感器芯片封装与透镜模块精确对准。
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公开(公告)号:US20060097405A1
公开(公告)日:2006-05-11
申请号:US11262907
申请日:2005-10-31
申请人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
CPC分类号: H01L23/055 , H01L23/10 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2224/85399 , H01L2224/05599
摘要: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.
摘要翻译: IC(集成电路)芯片封装包括基板(2),芯片(3),多个接合线(32)和盖(5)。 衬底具有顶表面,底表面,限定在其中的接收室(23),围绕顶表面和底表面布置的多个焊盘(24),以及多个通孔(25),其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中,并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口,并且具有比基板更小的轮廓,从而不覆盖顶表面的周边区域。
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公开(公告)号:US20060273249A1
公开(公告)日:2006-12-07
申请号:US11398023
申请日:2006-04-04
申请人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
发明人: Steven Webster , Ying-Cheng Wu , Po-Chih Hsu , Kun-Hsieh Liu
IPC分类号: H01J5/02
CPC分类号: H01L27/14618 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48992 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.
摘要翻译: 图像传感器芯片封装(200)包括基座(20),图像传感器芯片(23),多个导线(24),粘合装置(26)和盖子(28)。 底座具有顶表面(201)和布置在顶表面上的多个顶垫(204)。 图像传感器芯片安装在基座的顶表面上,并且在感光区域周围包括感光区域(231)和多个芯片焊盘(232)。 电线将图像传感器芯片的芯片焊盘与基座的顶部焊盘电连接。 粘合剂装置应用于图像传感器芯片的周边边缘,覆盖与芯片焊盘连接的导线和覆盖区域。 盖是透明的,并通过粘合装置安装到图像传感器芯片上。 盖子密封图像传感器芯片的感光区域。
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公开(公告)号:US07540672B2
公开(公告)日:2009-06-02
申请号:US11262592
申请日:2005-10-31
申请人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
发明人: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu , Po-Chih Hsu
IPC分类号: G03B17/00
CPC分类号: H04N5/2254 , G02B7/025 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H04N5/2253 , H01L2924/00014
摘要: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.
摘要翻译: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装(2)和透镜镜筒(30)。 图像传感器封装包括基板(20),图像传感器芯片(22)和盖子(28)。 衬底在其中限定接收室(203)。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部,从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分(29)。 镜筒包括容纳在其中的至少一个透镜(31)。 透镜筒牢固地附接到基板的顶部的未覆盖部分。
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公开(公告)号:US20080303939A1
公开(公告)日:2008-12-11
申请号:US11925293
申请日:2007-10-26
申请人: PO-CHIH HSU , MING-YUAN LIN
发明人: PO-CHIH HSU , MING-YUAN LIN
CPC分类号: H01L27/14625 , H01L27/14618 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要: An exemplary camera module includes a base, an image sensor chip, a lens holder, a lens module, at least one electronic element, and a light transmittance element. The base defines a first cavity. The image sensor chip is disposed on the base and includes a photosensitive area. The image sensor chip covers the first cavity. The lens holder is disposed on the base. The lens holder includes a first chamber and a second chamber disposed on the base. The second chamber covers the image sensor chip. The lens module is partially received in the first chamber. The lens module is optically aligned with the image sensor chip. The at least one electronic element is disposed in the first cavity. The light transmittance element is fixed on the image sensor chip. The light transmittance element is received in the second chamber and contacts the second chamber.
摘要翻译: 示例性相机模块包括基座,图像传感器芯片,透镜保持器,透镜模块,至少一个电子元件和透光元件。 基座限定第一腔。 图像传感器芯片设置在基座上并且包括感光区域。 图像传感器芯片覆盖第一腔。 透镜架设在基座上。 透镜架包括设置在基座上的第一室和第二室。 第二个房间覆盖图像传感器芯片。 透镜模块部分地容纳在第一腔室中。 镜头模块与图像传感器芯片光学对准。 至少一个电子元件设置在第一腔中。 透光元件固定在图像传感器芯片上。 透光元件被接收在第二腔室中并接触第二腔室。
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