Digital camera module with small sized image sensor chip package
    2.
    发明申请
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号:US20060290802A1

    公开(公告)日:2006-12-28

    申请号:US11402467

    申请日:2006-04-12

    IPC分类号: H04N5/225

    CPC分类号: H04N5/2253 H04N5/2254

    摘要: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    摘要翻译: 数码相机模块(200)包括透镜保持器(20),容纳在透镜保持器中的透镜模块(30)和安装到透镜保持器的图像传感器芯片封装(40)。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒(301)和容纳在镜筒中的至少一个透镜(302)。 图像传感器芯片封装包括基座(401),安装在基座上的图像传感器芯片(402),透明盖(405)和相对于图像传感器芯片定位透明盖的粘合剂(50)。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

    Digital still camera module
    3.
    发明申请
    Digital still camera module 有权
    数码相机模组

    公开(公告)号:US20060093352A1

    公开(公告)日:2006-05-04

    申请号:US11262592

    申请日:2005-10-31

    IPC分类号: G03B17/00

    摘要: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

    摘要翻译: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装(2)和透镜镜筒(30)。 图像传感器封装包括基板(20),图像传感器芯片(22)和盖子(28)。 衬底在其中限定接收室(203)。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部,从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分(29)。 镜筒包括容纳在其中的至少一个透镜(31)。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

    Digital camera module with small sized image sensor chip package
    4.
    发明授权
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号:US07643081B2

    公开(公告)日:2010-01-05

    申请号:US11402467

    申请日:2006-04-12

    IPC分类号: H04N5/225

    CPC分类号: H04N5/2253 H04N5/2254

    摘要: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    摘要翻译: 数码相机模块(200)包括透镜保持器(20),容纳在透镜保持器中的透镜模块(30)和安装到透镜保持器的图像传感器芯片封装(40)。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒(301)和容纳在镜筒中的至少一个透镜(302)。 图像传感器芯片封装包括基座(401),安装在基座上的图像传感器芯片(402),透明盖(405)和相对于图像传感器芯片定位透明盖的粘合剂(50)。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

    DIGITAL CAMERA MODULE PACKAGE
    6.
    发明申请
    DIGITAL CAMERA MODULE PACKAGE 审中-公开
    数码相机模块包

    公开(公告)号:US20080095529A1

    公开(公告)日:2008-04-24

    申请号:US11617070

    申请日:2006-12-28

    IPC分类号: G03B17/00

    摘要: A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.

    摘要翻译: 数码相机模块封装(200)包括基座(20),图像传感器芯片封装(21)和透镜模块(22)。 图像传感器芯片封装安装在基座上。 透镜模块包括空腔(257)。 空腔适合接收图像传感器芯片封装,并且压靠图像传感器芯片封装的圆周壁。 数码相机模块包可以将图像传感器芯片封装与透镜模块精确对准。

    Digital still camera module
    9.
    发明授权
    Digital still camera module 有权
    数码相机模组

    公开(公告)号:US07540672B2

    公开(公告)日:2009-06-02

    申请号:US11262592

    申请日:2005-10-31

    IPC分类号: G03B17/00

    摘要: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

    摘要翻译: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装(2)和透镜镜筒(30)。 图像传感器封装包括基板(20),图像传感器芯片(22)和盖子(28)。 衬底在其中限定接收室(203)。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部,从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分(29)。 镜筒包括容纳在其中的至少一个透镜(31)。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

    CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP
    10.
    发明申请
    CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP 审中-公开
    具有图像传感器芯片紧凑包装的相机模块

    公开(公告)号:US20080303939A1

    公开(公告)日:2008-12-11

    申请号:US11925293

    申请日:2007-10-26

    IPC分类号: H04N5/225 H01L27/00

    摘要: An exemplary camera module includes a base, an image sensor chip, a lens holder, a lens module, at least one electronic element, and a light transmittance element. The base defines a first cavity. The image sensor chip is disposed on the base and includes a photosensitive area. The image sensor chip covers the first cavity. The lens holder is disposed on the base. The lens holder includes a first chamber and a second chamber disposed on the base. The second chamber covers the image sensor chip. The lens module is partially received in the first chamber. The lens module is optically aligned with the image sensor chip. The at least one electronic element is disposed in the first cavity. The light transmittance element is fixed on the image sensor chip. The light transmittance element is received in the second chamber and contacts the second chamber.

    摘要翻译: 示例性相机模块包括基座,图像传感器芯片,透镜保持器,透镜模块,至少一个电子元件和透光元件。 基座限定第一腔。 图像传感器芯片设置在基座上并且包括感光区域。 图像传感器芯片覆盖第一腔。 透镜架设在基座上。 透镜架包括设置在基座上的第一室和第二室。 第二个房间覆盖图像传感器芯片。 透镜模块部分地容纳在第一腔室中。 镜头模块与图像传感器芯片光学对准。 至少一个电子元件设置在第一腔中。 透光元件固定在图像传感器芯片上。 透光元件被接收在第二腔室中并接触第二腔室。