Invention Grant
US07437029B2 Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip
有权
用于发射机光子集成电路（TXPIC）芯片的制造方法和装置
- Patent Title: Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip
- Patent Title (中): 用于发射机光子集成电路（TXPIC）芯片的制造方法和装置
-
Application No.: US11279004Application Date: 2006-04-07
-
Publication No.: US07437029B2Publication Date: 2008-10-14
- Inventor: Charles H. Joyner , Fred A. Kish, Jr. , Frank H. Peters , Atul Mathur , David F. Welch , Andrew G. Dentai , Damien Lambert , Richard P. Schneider , Mark J. Missey
- Applicant: Charles H. Joyner , Fred A. Kish, Jr. , Frank H. Peters , Atul Mathur , David F. Welch , Andrew G. Dentai , Damien Lambert , Richard P. Schneider , Mark J. Missey
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agent W. Douglas Carothers, Jr.
- Main IPC: G02B6/12
- IPC: G02B6/12
Abstract:
A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.
Public/Granted literature
- US20060228067A1 Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip Public/Granted day:2006-10-12
Information query
