公开(公告)号：US09031412B2

公开(公告)日：2015-05-12

申请号：US12612646

申请日：2009-11-04

Applicant: Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  David F. Welch ,  Drew D. Perkins ,  Masaki Kato

Inventor： Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  David F. Welch ,  Drew D. Perkins ,  Masaki Kato

IPC: H04J14/02 ,  H04B10/50 ,  G02B6/12 ,  B82Y20/00 ,  H01S5/024 ,  H01S5/223 ,  H01S5/40 ,  G02B6/28 ,  G02B6/293 ,  H01S5/00 ,  H01S5/022 ,  H01S5/026 ,  H01S5/0683 ,  H01S5/10 ,  H01S5/12 ,  H01S5/343

CPC classification number: G02B6/12033 ,  B82Y20/00 ,  G02B6/12019 ,  G02B6/2813 ,  G02B6/293 ,  G02B6/29317 ,  G02B6/29338 ,  G02B6/29352 ,  H01S5/005 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/0261 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0683 ,  H01S5/1032 ,  H01S5/12 ,  H01S5/1221 ,  H01S5/2231 ,  H01S5/34306 ,  H01S5/4031 ,  H01S5/4087 ,  H04B10/506

Abstract: A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature. However, control is maintained such that the channel spectral spacing between channels across multiple signal channels, whether such spacing is periodic or aperiodic, between adjacent laser sources in the thermally floating wavelength grid are maintained in a fixed relationship. Means are then provided at an optical receiver to discover and lock onto floating wavelength grid of transmitted WDM signals and thereafter demultiplex the transmitted WDM signals for OE conversion.

公开(公告)号：US08705904B2

公开(公告)日：2014-04-22

申请号：US12263471

申请日：2008-11-01

Applicant: Fred A. Kish, Jr. ,  Mehrdad Ziari ,  Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Vincent G. Dominic ,  Sanjeev Murthy ,  Alan Nilsson

Inventor： Fred A. Kish, Jr. ,  Mehrdad Ziari ,  Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Vincent G. Dominic ,  Sanjeev Murthy ,  Alan Nilsson

IPC: G02B6/12 ,  H04J14/02 ,  H04B10/04 ,  H04B10/12

CPC classification number: G02B6/12004 ,  G02B6/12019 ,  G02B6/4249 ,  H01S5/02248 ,  H01S5/0268 ,  H01S5/4087 ,  H04J14/02

Abstract: Consistent with the present disclosure, optical devices are provided along different optical paths in a photonic integrated circuit (PIC). The optical components have different optical losses associated therewith so that optical signals propagating in the optical paths have desired power levels, which may be uniform, for example.

Abstract translation: 根据本公开，光子器件沿着光子集成电路（PIC）中的不同光路提供。 光学部件具有与其相关的不同的光学损耗，使得在光路中传播的光信号具有期望的功率电平，例如可以是均匀的。

公开(公告)号：US07885492B2

公开(公告)日：2011-02-08

申请号：US10317935

申请日：2002-12-11

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Ting-Kuang Chiang ,  Marco E. Sosa

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Ting-Kuang Chiang ,  Marco E. Sosa

IPC: G02B6/12

CPC classification number: G02B6/12011 ,  B82Y20/00 ,  G01R31/31728 ,  G01R31/318511 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12021 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4204 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/69 ,  H01L31/125 ,  H01S5/0014 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/06832 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04J14/02 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0258 ,  H04J14/0265 ,  H04J14/0276 ,  H04J14/0282

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07625771B2

公开(公告)日：2009-12-01

申请号：US11358784

申请日：2006-02-21

Applicant: Charles H. Joyner ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr.

Inventor： Charles H. Joyner ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr.

IPC: H01L21/00

CPC classification number: G02B6/12011 ,  G02B6/12016 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/132 ,  G02B6/42 ,  G02B2006/12097 ,  G02B2006/12176 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/1014 ,  H01S5/2213 ,  H01S5/2231 ,  H01S5/227 ,  H01S5/4031 ,  H01S5/4087

Abstract: A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.

Abstract translation: 一种用于将多个输入或输出波导之间的过渡区域中的插入损耗减小到光子集成电路（PIC）中的自由空间耦合器区域的方法包括以下步骤：在波导和区域上形成钝化层并形成钝化覆盖层 使得其通过过渡区域到自由空间耦合器区域的厚度单调增加。

公开(公告)号：US07546001B2

公开(公告)日：2009-06-09

申请号：US11735462

申请日：2007-04-14

Applicant: David F. Welch ,  Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Vincent G. Dominic ,  Ting-Kuang Chiang

Inventor： David F. Welch ,  Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Vincent G. Dominic ,  Ting-Kuang Chiang

IPC: G02B6/12 ,  G02B6/28 ,  H04B14/00 ,  H04B14/02

CPC classification number: H04B10/2914 ,  B82Y20/00 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/1203 ,  G02B6/12033 ,  G02B6/4249 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/101 ,  H01S5/1014 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/183 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/3404 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H01S5/5072 ,  H04B10/25 ,  H04B10/50 ,  H04B10/675 ,  H04J14/02

Abstract: Monolithic photonic integrated circuits (PICs) utilize forward error correction (FEC) joint encoder or plural encoders or a joint decoder or plural decoders.

Abstract translation: 单片光子集成电路（PIC）利用前向纠错（FEC）联合编码器或多个编码器或联合解码器或多个解码器。

公开(公告)号：US07268371B2

公开(公告)日：2007-09-11

申请号：US11230722

申请日：2005-09-19

Applicant: Michael R Krames ,  Fred A Kish, Jr. ,  Tun S Tan

Inventor： Michael R Krames ,  Fred A Kish, Jr. ,  Tun S Tan

IPC: H01L29/22 ,  H01L29/227

CPC classification number: H01L33/20 ,  H01L33/02 ,  H01L33/08 ,  H01L33/14 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684

Abstract: A method for designing semiconductor light emitting devices is disclosed wherein the side surfaces (surfaces not parallel to the epitaxial layers) are formed at preferred angles relative to vertical (normal to the plane of the light-emitting active layer) to improve light extraction efficiency and increase total light output efficiency. Device designs are chosen to improve efficiency without resorting to excessive active area-yield loss due to shaping. As such, these designs are suitable for low-cost, high-volume manufacturing of semiconductor light-emitting devices with improved characteristics.

Abstract translation: 公开了一种用于设计半导体发光器件的方法，其中侧表面（不平行于外延层的表面）以相对于垂直（垂直于发光有源层的平面）的优选角度形成，以提高光提取效率， 提高总光输出效率。 选择器件设计以提高效率，而不需要由于成形而过度的有效面积产量损失。 因此，这些设计适用于具有改进特性的半导体发光器件的低成本，大批量制造。

公开(公告)号：US07224858B2

公开(公告)日：2007-05-29

申请号：US11030466

申请日：2005-01-06

Applicant: David F. Welch ,  Ting-Kuang Chiang ,  Radhakrishnan L. Nagarajan ,  Vincent G. Dominic ,  Fred A. Kish, Jr.

Inventor： David F. Welch ,  Ting-Kuang Chiang ,  Radhakrishnan L. Nagarajan ,  Vincent G. Dominic ,  Fred A. Kish, Jr.

IPC: G02B6/12 ,  G02B6/28 ,  G02B6/34 ,  H04B10/12

CPC classification number: H04B10/2914 ,  B82Y20/00 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/1203 ,  G02B6/12033 ,  G02B6/4249 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/101 ,  H01S5/1014 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/183 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/3404 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H01S5/5072 ,  H04B10/25 ,  H04B10/50 ,  H04B10/675 ,  H04J14/02

Abstract: An optical receiver photonic integrated circuit (RxFIC) comprises a semiconductor monolithic chip having an input to receive from an optical transmissior link a combined channel signal originating from an optical transmitter source and comprising a plurality of channel signals having different wavelengths forming a wavelength grid. An optical decorobiner is integrated in the chip and optically coupled to the input to receive the multiplexed channel signal and provide a decombined individual channel signal on an output waveguide of a plurality of such output waveguides provided from the optical decombiner. A plurality of photodetectors are also integrated in the chip and each photodetector is optically coupled to one of the output waveguides to receive a decombined channel signal and convert the channel signal to an electrical signal. A controller is coupled to receive a portion of the converted signals to determine at least one performance property of the signals and provide service channel signal as feedback about that property via the semiconductor monolithic chip to the optical transmitter source. The controller is coupled to an integrated optical service channel (OSC) on the chip that has a light source which is modulated by the service channel signal. The light source may he integrated on the chip. The optical service channel (OSC) is coupled as an input to the decombiner for transport off the chip to optical transmitter source.

Abstract translation: 光接收机光子集成电路（RxFIC）包括半导体单片芯片，其具有从光传输链路接收源自光发射机源的组合信道信号的输入，并且包括具有形成波长网格的不同波长的多个信道信号。 光学装饰机被集成在芯片中并且光学耦合到输入端以接收多路复用的信道信号，并且在由光学分解器提供的多个这样的输出波导的输出波导上提供去复合的单独信道信号。 多个光电检测器也集成在芯片中，并且每个光电检测器光耦合到输出波导中的一个，以接收解复用通道信号并将通道信号转换为电信号。 控制器被耦合以接收转换信号的一部分以确定信号的至少一个性能特性，并且将服务信道信号作为关于经由半导体单芯片到光发射机源的属性的反馈提供。 控制器耦合到芯片上的集成光学服务信道（OSC），其具有由服务信道信号调制的光源。 光源可以集成在芯片上。 光服务信道（OSC）作为输入端耦合到分解器，用于从芯片传输到光发射机源。

公开(公告)号：US07155078B2

公开(公告)日：2006-12-26

申请号：US11030762

申请日：2005-01-07

Applicant: David F. Welch ,  Ting-Kuang Chiang ,  Radhakrishnan L. Nagarajan ,  Vincent G. Dominic ,  Fred A. Kish, Jr.

Inventor： David F. Welch ,  Ting-Kuang Chiang ,  Radhakrishnan L. Nagarajan ,  Vincent G. Dominic ,  Fred A. Kish, Jr.

IPC: G02B6/12 ,  G02B6/28 ,  H04B10/04 ,  H04B10/12

CPC classification number: H04B10/2914 ,  B82Y20/00 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/1203 ,  G02B6/12033 ,  G02B6/4249 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  H01S5/026 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/101 ,  H01S5/1014 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/183 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/3404 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H01S5/5072 ,  H04B10/25 ,  H04B10/50 ,  H04B10/675 ,  H04J14/02

Abstract: An optical transmitter photonic integrated circuit (TxPIC) comprises a semiconductor monolithic chip with a plurality of optical signal channels where each channel comprises a modulated signal source. The output from the modulated signal sources are coupled to an input of an integrated optical combiner to form a WDM output signal for transmission off the TxPIC chip to an optical transmission link. An optical service channel (OSC) is also integrated on the TxPIC chip to receive a service signal from the optical receiver source which is also coupled the optical transmission link.

Abstract translation: 光发射器光子集成电路（TxPIC）包括具有多个光信号通道的半导体单片芯片，其中每个通道包括调制信号源。 来自调制信号源的输出耦合到集成光组合器的输入端以形成用于从TxPIC芯片传输到光传输链路的WDM输出信号。 光服务信道（OSC）也被集成在TxPIC芯片上，以从光接收机源接收服务信号，光接收机也耦合光传输链路。

公开(公告)号：US07087449B2

公开(公告)日：2006-08-08

申请号：US10875418

申请日：2004-06-24

Applicant: Fred A. Kish, Jr. ,  Sheila K. Mathis ,  Charles H. Joyner ,  Richard P. Schneider

Inventor： Fred A. Kish, Jr. ,  Sheila K. Mathis ,  Charles H. Joyner ,  Richard P. Schneider

IPC: H01L21/20

CPC classification number: B82Y20/00 ,  H01L31/03046 ,  H01L31/109 ,  H01L33/145 ,  H01S5/026 ,  H01S5/2072 ,  H01S5/221 ,  H01S5/2224 ,  H01S5/2226 ,  H01S5/2227 ,  H01S5/2231 ,  H01S5/227 ,  H01S5/2275 ,  H01S5/3072 ,  H01S5/34306 ,  Y02E10/544

Abstract: An active semiconductor device, such as, buried heterostructure semiconductor lasers, LEDs, modulators, photodiodes, heterojunction bipolar transistors, field effect transistors or other active devices, comprise a plurality of semiconductor layers formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III–V compound, i.e., an Al-III–V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III–V layer. An example of a material system for this invention useful at optical telecommunication wavelengths is InGaAsP/InP where the Al-III–V layer comprises InAlAs:O or InAlAs:O:Fe. Other materials for the blocking layers may be InAlGaAs or alternating layers or alternating monolayers of AlAs/InAs. Thus, the O-doped blocking layers may be undoped, impurity doped or co-doped with Fe.

公开(公告)号：US07079719B2

公开(公告)日：2006-07-18

申请号：US10915073

申请日：2004-08-10

Applicant: Fred A. Kish, Jr. ,  Charles H. Joyner ,  David F. Welch ,  Jonas Webjorn ,  Robert B. Taylor ,  Alan C. Nilsson

Inventor： Fred A. Kish, Jr. ,  Charles H. Joyner ,  David F. Welch ,  Jonas Webjorn ,  Robert B. Taylor ,  Alan C. Nilsson

IPC: G02B6/12

CPC classification number: G02B6/12033 ,  B82Y20/00 ,  G02B6/02204 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/124 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  H01S5/0085 ,  H01S5/024 ,  H01S5/02415 ,  H01S5/02453 ,  H01S5/02461 ,  H01S5/02476 ,  H01S5/026 ,  H01S5/0261 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/0687 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2214 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/2272 ,  H01S5/2275 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04B10/506 ,  H04B10/572 ,  H04J14/02

Abstract: A method of tuning optical components integrated on a monolithic chip, such as an optical transmitter photonic integrated circuit (TxPIC), is disclosed where a group of first optical components are each fabricated to have an operating wavelength approximating a wavelength on a standardized or predetermined wavelength grid and are each included with a local wavelength tuning component also integrated in the chip. Each of the first optical components is wavelength tuned through their local wavelength tuning component to achieve a closer wavelength response that approximates their wavelength on the wavelength grid.

Abstract translation: 公开了一种整合在诸如光发射器光子集成电路（TxPIC）的单片芯片上的光学元件的调谐方法，其中每组制造一组第一光学部件以使工作波长接近标准化或预定波长的波长 并且每个都包含在也集成在芯片中的本地波长调谐组件。 通过其局部波长调谐组件对每个第一光学部件进行波长调谐，以实现更接近其在波长网格上的波长的波长响应。