发明授权
US07449519B2 Curing resin, method for producing same and curing resin composition
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固化树脂,其制备方法和固化树脂组合物
- 专利标题: Curing resin, method for producing same and curing resin composition
- 专利标题(中): 固化树脂,其制备方法和固化树脂组合物
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申请号: US10546017申请日: 2004-02-16
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公开(公告)号: US07449519B2公开(公告)日: 2008-11-11
- 发明人: Shinichi Sato , Yukihiro Nomura , Jun Inui
- 申请人: Shinichi Sato , Yukihiro Nomura , Jun Inui
- 申请人地址: JP
- 专利权人: Konishi Co., Ltd.
- 当前专利权人: Konishi Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Kilpatrick Stockton LLP
- 优先权: JP2003-039305 20030218
- 国际申请: PCT/JP2004/001627 WO 20040216
- 国际公布: WO2004/074330 WO 20040902
- 主分类号: C08F8/00
- IPC分类号: C08F8/00
摘要:
An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule, thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.
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