发明授权
- 专利标题： Method of making circuitized substrate with signal wire shielding
- 专利标题（中）： 用信号线屏蔽制作电路化基板的方法
-
申请号： US11429990申请日： 2006-05-09
-
公开(公告)号： US07478472B2公开(公告)日： 2009-01-20
- 发明人: John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
- 申请人： John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell LLP
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H05K3/36
- IPC分类号： H05K3/36 ; H01B7/29
摘要：
A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
公开/授权文献
信息查询
