发明授权
- 专利标题: Substrate processing apparatus and method, high speed rotary valve and cleaning method
- 专利标题(中): 基板加工装置及方法,高速旋转阀及清洗方法
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申请号: US10946511申请日: 2004-09-20
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公开(公告)号: US07481902B2公开(公告)日: 2009-01-27
- 发明人: Hiroshi Shinriki , Junichi Arami
- 申请人: Hiroshi Shinriki , Junichi Arami
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Ladas & Parry LLP
- 优先权: JP2002-086774 20020326
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; C23C16/00 ; C23C14/00
摘要:
A substrate processing apparatus includes a processing vessel provided with a stage holding thereon a substrate to be processed and evacuated at an evacuation port, and a source gas supplying system that supplies plural source gases to the processing vessel separately in the form of a laminar flow, wherein the evacuation port has a slit-form shape extending in a direction generally intersecting perpendicularly to a direction of the laminar flow, the evacuation port is engaged with a valve having a valve body formed with a slit-form opening corresponding to the slit-form shape of the evacuation port, the slit-form opening being provided so as to cause a displacement with respect to the evacuation port in a direction generally intersecting perpendicularly to an extending direction of the evacuation port, the valve changing a degree of valve opening thereof via displacement of said slit-form opening.