发明授权
- 专利标题： Micro-device packaging
- 专利标题（中）： 微型设备包装
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申请号： US11105234申请日： 2005-04-12
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公开(公告)号： US07482682B2公开(公告)日： 2009-01-27
- 发明人: Chien-Hua Chen , Henry Kang , Bradley Charles John
- 申请人： Chien-Hua Chen , Henry Kang , Bradley Charles John
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the transparent material bonded to a silicon layer on the other of the substrate or the transparent material.
公开/授权文献
- US20060226524A1 Micro-device packaging 公开/授权日：2006-10-12
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