发明授权
- 专利标题： Polishing composition
- 专利标题（中）： 抛光组成
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申请号： US10952672申请日： 2004-09-29
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公开(公告)号： US07485162B2公开(公告)日： 2009-02-03
- 发明人: Tsuyoshi Matsuda , Tatsuhiko Hirano , Junhui Oh , Atsunori Kawamura , Kenji Sakai
- 申请人： Tsuyoshi Matsuda , Tatsuhiko Hirano , Junhui Oh , Atsunori Kawamura , Kenji Sakai
- 申请人地址： JP Nishikasugai-Gun, Aichi
- 专利权人： Fujimi Incorporated
- 当前专利权人： Fujimi Incorporated
- 当前专利权人地址： JP Nishikasugai-Gun, Aichi
- 代理机构： Vidas, Arrett & Steinkraus
- 优先权： JP2003-342530 20030930; JP2003-342531 20030930; JP2003-352952 20031010; JP2003-394593 20031125; JP2003-396171 20031126
- 主分类号： B24D3/02
- IPC分类号： B24D3/02 ; C09C1/68 ; C09K3/14
摘要：
A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.
公开/授权文献
- US20050108949A1 Polishing composition 公开/授权日：2005-05-26
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